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14 Dec 2023
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Optimized for intensive compute

Compute intensive workloads do not necessarily require large amounts of storage. The SD550 V3 multi-node server is optimized for these workloads by maximizing density, providing up to 2x the cores than a standard 2U rack server, and doesn’t add costs with unnecessary storage.

The 2U half-width format with up to 2 CPUs maximizes core density, saves rack space, and lowers OPEX.

Flexible infrastructure

The SD550 V3 provides the density, performance, flexible storage, and multiple network options required for a hyperconverged infrastructure.

Easily scale out as needed with the ability populate the ThinkSystem D3 Chassis starting with one node and adding more as workloads expand. The SD550 V3 also adds greater flexibility to your rack space with the ability to mix node types in the same chassis to meet your processing needs.

Increase efficiency and sustainability

The most efficient of the Lenovo multi-node server portfolio, the SD550 V3 utilizes three 2U fans versus eight in a standard 2U rack server. The lower number of fans and solid-state drives, reduces overall energy consumption while increasing processing capabilities.

Pre-installed, tested, shipping options available to reduce packaging waste and speed deployment.

Easily managed

Included with the SD550 V3 is XClarity Controller system management, providing advanced service-processor control, monitoring, and alerting functions.

Lenovo XClarity Controller is a hardware embedded management engine common in every two-socket ThinkSystem server. XClarity Controller features an uncluttered graphical user interface, industry standard Redfish-compliant REST APIs.


Form Factor/Height

2U half-width multi-node dense server (node)
Processor 2x 5th Gen Intel® Xeon® Scalable processors, up to 350W
Memory Up to 2TB using 16x 128GB TruDDR5 DIMMs per node
Storage 6x 2.5” SAS/SATA/NVMe SSDs
2x M.2 NVMe boot drives
Network Interface 1x 1GbE Dedicated Management
I/O Expansion 1x OCP 3.0 slot
2x PCIe x16 FHHL slots (1x Gen5, 1x Gen4)
GPU Support Up to 2x single-wide GPUs
Power Supply Chassis supports up to 3x Power Supply Units, up to 2700W each
ERP Lot 9 Support
Systems Management ThinkSystem XCC2 Controller with Hardware Root of Trust
TPM 2.0 embedded, with optional TCM
OS Support Microsoft, Red Hat, SUSE, VMware, Linux. Visit for details.
Limited Warranty 1 & 3-year base warranty, next business day 9x5, optional 4th & 5th year service upgrades

About Lenovo

Lenovo (HKSE: 992) (ADR: LNVGY) is a US$62 billion revenue global technology powerhouse, ranked #171 in the Fortune Global 500, employing 77,000 people around the world, and serving millions of customers every day in 180 markets. Focused on a bold vision to deliver smarter technology for all, Lenovo is expanding into new growth areas of infrastructure, mobile, solutions and services. This transformation is building a more inclusive, trustworthy, and sustainable digital society for everyone, everywhere.

For More Information

To learn more about the ThinkSystem SD550 V3, contact your Lenovo representative or Business Partner or visit For detailed specifications, consult the SD550 V3 product guide.

Learn more about Lenovo Storage
Learn more about Lenovo Services
Learn more about Lenovo TruScale

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Availability: Offers, prices, specifications and availability may change without notice. Lenovo is not responsible for photographic or typographic errors. Warranty: For a copy of applicable warranties, write to: Lenovo Warranty Information, 1009 Think Place, Morrisville, NC, 27560. Lenovo makes no representation or warranty regarding third-party products or services.

Trademarks: Lenovo, the Lenovo logo, ThinkSystem®, and XClarity® are trademarks or registered trademarks of Lenovo. Intel® and Xeon® are trademarks of Intel Corporation or its subsidiaries. Linux® is the trademark of Linus Torvalds in the U.S. and other countries. Microsoft® is a trademark of Microsoft Corporation in the United States, other countries, or both. Other company, product, or service names may be trademarks or service marks of others.

Document number DS0176, published December 14, 2023. For the latest version, go to

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