skip to main content

Lenovo ThinkSystem SD665 V3 Neptune DWC Server

Product Guide

Top

Abstract

The ThinkSystem SD665 V3 Neptune DWC server is the next-generation high-performance server based on the fifth generation Lenovo Neptune™ direct water cooling platform.

With two fourth-generation AMD EPYC processors, the ThinkSystem SD665 V3 server combines the latest AMD processors and Lenovo's market-leading water-cooling solution, which results in extreme performance in an extreme dense packaging.

This product guide provides essential pre-sales information to understand the SD665 V3 server, its key features and specifications, components and options, and configuration guidelines. This guide is intended for technical specialists, sales specialists, sales engineers, IT architects, and other IT professionals who want to learn more about the SD665 V3 and consider its use in IT solutions.

Introduction

The ThinkSystem SD665 V3 Neptune DWC node is the next-generation high-performance server based on the fifth generation Lenovo Neptune™ direct water cooling platform.

With two fourth-generation AMD EPYC processors, the ThinkSystem SD665 V3 node combines the latest AMD processors and Lenovo's market-leading water-cooling solution, which results in extreme performance in an extreme dense packaging, supporting your application from Exascale to Everyscale™.

The direct water cooled solution is designed to operate by using warm water, up to 45°C (113°F). Chillers are not needed for most customers, meaning even greater savings and a lower total cost of ownership. The nodes are housed in the upgraded ThinkSystem DW612S enclosure, a 6U rack mount unit that fits in a standard 19-inch rack.

The Lenovo ThinkSystem SD665 V3 server tray with two distinct two-socket nodes
Figure 1. The Lenovo ThinkSystem SD665 V3 server tray with two distinct two-socket nodes

Did you know?

The ThinkSystem SD665 V3 server tray and DW612S enclosure with direct water cooling provide the ultimate in data center cooling efficiencies and performance. The water loop design is bifurcating to balance and parallelize the cooling across all major heat sources in both nodes. This ensures temperature uniformity to avoid thermal jitter as you would observe in serial loops. Combined with the low pressure-drop design, you can use higher water temperatures on the highest performing chips while benefiting from saving energy and cost associated to cold water chillers.

Key features

The Lenovo ThinkSystem SD665 V3 dual-node server tray is designed for High Performance Computing (HPC), large-scale cloud, heavy simulations, and modeling. It implements Lenovo Neptune™ Direct Water Cooling (DWC) technology to optimally support workloads from technical computing, grid deployments, analytics, and is ideally suited for fields such as research, life sciences, energy, simulation, and engineering.

The unique design of ThinkSystem SD665 V3 provides the optimal balance of serviceability, performance, and efficiency. By using a standard rack with the ThinkSystem DW612S enclosure equipped with patented stainless steel drip-less quick connectors, the SD665 V3 provides easy serviceability and extreme density that is well suited for clusters ranging from small enterprises to the world's largest supercomputers.

The Lenovo Neptune™ direct liquid cooling doesn't use risky plastic retrofitting but instead custom-designed copper water loops, so you have peace of mind implementing a platform with liquid cooling at the core of the design.

Compared to other technology, the SD665 V3 direct water cooling:

  • Reduces data center energy costs by up to 40%
  • Increases system performance by up to 10%
  • Delivers up to 100% heat removal efficiency into water (depending on environment)
  • Creates a quieter data center with its fan-less design
  • Enables data center growth without adding computer room air conditioning

Lenovo’s direct water-cooled solutions are factory-integrated and are re-tested at the rack-level to ensure that a rack can be directly deployed at the customer site. This careful and consistent quality testing has been developed as a result of over a decade of experience designing and deploying DWC solutions to the very highest standards.

Scalability and performance

The ThinkSystem SD665 V3 server tray and DW612S enclosure offer the following features to boost performance, improve scalability, and reduce costs:

  • Each SD665 V3 node supports two fourth-generation AMD EPYC processors, 24x TruDDR5 DIMMs, up to two PCIe 5.0 slots for high-speed I/O, and up to two drive bays, in a half-wide 1U form factor.
  • Up to 12x SD665 V3 nodes are installed in 6x trays in the DW612S enclosure, occupying only 6U of rack space. It is a highly dense, scalable, and price-optimized offering.
  • Supports two fourth-generation AMD EPYC 9004 processors
    • Up to 96 cores and 192 threads
    • Core speed of up to 4.1 GHz
    • Nominal TDP rating of up to 360 W, configurable TDP up to 400 W
  • Support for DDR5 memory DIMMs to maximize the performance of the memory subsystem:
    • Up to 24 DDR5 memory DIMMs, 12 DIMMs per processor
    • 12 memory channels per processor (1 DIMM per channel)
    • DIMM speeds up to 4800 MHz
    • Using 128GB 3DS RDIMMs, the node supports up to 3TB of system memory
  • Supports combinations of PCIe 5.0 x16 slots and SSDs, as follows:
    • One PCIe 5.0 x16 slot and two 7mm SSDs
    • One PCIe 5.0 x16 slot and one 15mm SSD
    • Two PCIe 5.0 x16 slots without SSDs (M.2 still supported)
  • Drives can be either SATA or high-performance NVMe drives, to maximize I/O performance in terms of throughput, bandwidth, and latency.
  • Supports a PCIe 4.0 x4 high-speed M.2 NVMe drive installed in an adapter for convenient operating system boot and internal storage functions.
  • The node includes one Gigabit and two 25 Gb Ethernet onboard ports for cost effective networking. High speed networking can be added through the included PCIe slots. 
  • The node offers PCI Express 5.0 I/O expansion capabilities that doubles the theoretical maximum bandwidth of PCIe 4.0 (32GT/s in each direction for PCIe 5.0, compared to 16 GT/s with PCIe 4.0). A PCIe 5.0 x16 slot provides 128 GB/s bandwidth, enough to support a 400GbE network connection.

Energy efficiency

The direct water cooled solution offers the following energy efficiency features to save energy, reduce operational costs, increase energy availability, and contribute to a green environment:

  • Water cooling eliminates power that is drawn by cooling fans in the enclosure and dramatically reduces the required air movement in the server room, which also saves power. In combination with an Energy Aware Runtime environment, savings as much as 40% are possible in the data center due to the reduced need for air conditioning.
  • Water chillers may not be required with a direct water cooled solution. Chillers are a major expense for most geographies and can be reduced or even eliminated because the water temperature can now be 45°C instead of 18°C in an air-cooled environment.
  • With the new water-cooled power supplies, essentially 100% system heat recovery is possible, depending on water and ambient temperature chosen. At 45°C water temperature and 30°C room temperature it will be typically around 95% through surface radiated heat. Heat energy absorbed may be reused for heating buildings in the winter, or generating cold through Adsorption Chillers, for further operating expense savings.
  • The processors and other microelectronics are run at lower temperatures because they are water cooled, which uses less power, and allows for higher performance through Turbo Mode.
  • The processors are run at uniform temperatures because they are cooled in parallel loops, which avoid thermal jitter and provides higher and more reliable performance at same power.
  • Low-voltage 1.1V DDR5 memory offers energy savings compared to 1.2V DDR4 DIMMs, an approximately 20% decrease in power consumption
  • 80 Plus Titanium power supplies ensure energy efficiency.
  • There are power monitoring and management capabilities through the System Management Module in the DW612S enclosure.
  • Lenovo power/energy meter based on TI INA226 measures DC power for the CPU at higher than 97% accuracy and 100 Hz sampling frequency to the XCC and can be leveraged both in-band and out-of-band using IPMI raw commands.
  • Optional Lenovo XClarity Energy Manager provides advanced data center power notification, analysis, and policy-based management to help achieve lower heat output and reduced cooling needs.
  • Optional Energy Aware Runtime provides sophisticated power monitoring and energy optimization on a job-level during the application runtime without impacting performance negatively.

Manageability and security

The following powerful systems management features simplify local and remote management of the SD665 V3 server:

  • The server includes an XClarity Controller 2 (XCC2) to monitor server availability. Optional upgrade to XCC Platinum to provide remote control (keyboard video mouse) functions, support for the mounting of remote media files, FIPS 140-3 security, enhanced NIST 800-193 support, boot capture, power capping, and other management and security features.
  • Lenovo XClarity Administrator offers comprehensive hardware management tools that help to increase uptime, reduce costs, and improve productivity through advanced server management capabilities.
  • Lenovo XClarity Provisioning Manager, based in UEFI and accessible from F1 during boot, provides system inventory information, graphical UEFI Setup, platform update function, RAID Setup wizard, operating system installation function, and diagnostic functions.
  • Support for Lenovo XClarity Energy Manager which captures real-time power and temperature data from the server and provides automated controls to lower energy costs.
  • Support for industry standard management protocols, IPMI 2.0, SNMP 3.0, Redfish REST API, serial console via IPMI
  • The SD665 V3 is enabled with Lenovo HPC & AI Software Stack, so, you can support multiple users and scale within a single cluster environment.
  • Lenovo HPC & AI Software Stack provides our HPC customers you with a fully tested and supported open-source software stack to enable your administrators and users with for the most effective and environmentally sustainable consumption of Lenovo supercomputing capabilities.
  • Our Confluent management system and Lenovo Intelligent Computing Orchestration (LiCO) web portal provides an interface designed to abstract the users from the complexity of HPC cluster orchestration and AI workloads management, making open-source HPC software consumable for every customer.
  • LiCO web portal provides workflows for both AI and HPC, and supports multiple AI frameworks, allowing you to leverage a single cluster for diverse workload requirements.
  • Integrated Trusted Platform Module (TPM) 2.0 support enables advanced cryptographic functionality, such as digital signatures and remote attestation.
  • Supports AMD Secure Root-of-Trust, Secure Run and Secure Move features to minimize potential attacks and protect data as the OS is booted, as applications are run and as applications are migrated from server to server.
  • Supports Secure Boot to ensure only a digitally signed operating system can be used.
  • Industry-standard Advanced Encryption Standard (AES) NI support for faster, stronger encryption.
  • With the System Management Module (SMM) installed in the enclosure, only one Ethernet connection is needed to provide remote systems management functions for all SD665 V3 servers and the enclosure.
  • The SMM management module has two Ethernet ports which allows a single Ethernet connection to be daisy chained across 7 enclosures and 84 servers, thereby significantly reducing the number of Ethernet switch ports needed to manage an entire rack of SD665 V3 servers and DW612S enclosures.
  • The DW612S enclosure includes drip sensors that monitor the inlet and outlet manifold quick connect couplers; leaks are reported via the SMM.
  • The server supports Lenovo XClarity suite software with Lenovo XClarity Administrator, Lenovo XClarity Provisioning Manager, and XClarity Energy Manager. They are described further in the Software section of this product guide.
  • Lenovo HPC & AI Software Stack provides our HPC customers you with a fully tested and supported open-source software stack to enable your administrators and users with for the most effective and environmentally sustainable consumption of Lenovo supercomputing capabilities.
  • Our Confluent management system and Lenovo Intelligent Computing Orchestration (LiCO) web portal provides an interface designed to abstract the users from the complexity of HPC cluster orchestration and AI workloads management, making open-source HPC software consumable for every customer.
  • LiCO web portal provides workflows for both AI and HPC, and supports multiple AI frameworks, allowing you to leverage a single cluster for diverse workload requirements.

Availability and serviceability

The SD665 V3 node and DW612S enclosure provide the following features to simplify serviceability and increase system uptime:

  • Designed to run 24 hours a day, 7 days a week
  • Depending on the configuration and node population, the DW612S enclosure supports N+1 power policies for its power supplies, which means greater system uptime.
  • All supported power supplies are hot-swappable, including the water-cooled power supplies.
  • Toolless cover removal on the trays provides easy access to upgrades and serviceable parts, such as adapters and memory.
  • The server uses ECC memory and supports memory RAS features including Single Device Data Correction (SDDC, also known as Chipkill), Patrol/Demand Scrubbing, Bounded Fault, DRAM Address Command Parity with Replay, DRAM Uncorrected ECC Error Retry, On-die ECC, ECC Error Check and Scrub (ECS), and Post Package Repair.
  • Proactive Platform Alerts (including PFA and SMART alerts): Processors, voltage regulators, memory, internal storage (HDDs and SSDs, NVMe SSDs, M.2 storage), fans, power supplies, and server ambient and subcomponent temperatures. Alerts can be surfaced through the XClarity Controller to managers such as Lenovo XClarity Administrator and other standards-based management applications. These proactive alerts let you take appropriate actions in advance of possible failure, thereby increasing server uptime and application availability.
  • The XCC offers optional remote management capability and can enable remote keyboard, video, and mouse (KVM) control and remote media for the node.
  • Built-in diagnostics in UEFI, using Lenovo XClarity Provisioning Manager, speed up troubleshooting tasks to reduce service time.
  • Lenovo XClarity Provisioning Manager supports diagnostics and can save service data to a USB key drive or remote CIFS share folder for troubleshooting and reduce service time.
  • Auto restart in the event of a momentary loss of AC power (based on power policy setting in the XClarity Controller service processor)
  • Virtual reseat is a supported feature of the System Management Module (SMM2) which simulates physically removing the node from A/C power and reconnecting the node to AC power from a remote location.
  • There is a three-year customer replaceable unit and onsite limited warranty, with next business day 9x5 coverage. Optional warranty upgrades and extensions are available.
  • With water cooling, system fans are not required. This results in significantly reduced noise levels on the data center floor, a significant benefit to personnel having to work on site.

Components and connectors

The front of the tray with two distinct SD665 V3 nodes is shown in the following figure.

Front view of the tray with two ThinkSystem SD665 V3 nodes
Figure 2. Front view of the tray with two ThinkSystem SD665 V3 nodes

The following figure shows key components internal to the server tray.

Inside view of the two SD665 V3 nodes in the water-cooled tray
Figure 3. Inside view of the two SD665 V3 nodes in the water-cooled tray

The compute nodes are installed in the ThinkSystem DW612S enclosure, as shown in the following figure.

Front view of the DW612S enclosure
Figure 4. Front view of the DW612S enclosure

The rear of the DW612S enclosure contains the power supplies, cooling water manifolds, and the System Management Module. The following figure shows rear of the enclosure with 6x air-cooled power supplies.

Rear view of the DW612S enclosure with 6 air-cooled power supplies
Figure 5. Rear view of the DW612S enclosure with 6 air-cooled power supplies

The also supports water-cooled power supplies for an increased level of heat removal using water. The following figure shows the enclosure with 3 water-cooled power supplies installed.

Rear view of the DW612S enclosure with 3 water-cooled power supplies
Figure 6. Rear view of the DW612S enclosure with 3 water-cooled power supplies

System architecture

The following figure shows the architectural block diagram of the SD665 V3.

SD665 V3 system architectural block diagram
Figure 7. SD665 V3 system architectural block diagram

Standard specifications - SD665 V3 tray

The following table lists the standard specifications of the SD665 V3 server tray.

Table 1. Standard specifications - SD665 V3 tray
Components Specification
Machine type 7D9P - 3-year warranty
Form factor Two independent 2-socket nodes mounted on a 1U water-cooled server tray
Enclosure support ThinkSystem DW612S Neptune DWC Enclosure
Processor Two AMD EPYC 9004 Series processors (formerly codenamed "Genoa") per node. Supports processors up to 96 cores, core speeds of up to 3.5 GHz, and TDP ratings of up to 360W, cTDP up to 400W. Supports PCIe 5.0 for high performance I/O.
Chipset Not applicable (platform controller hub functions are integrated into the processor)
Memory 24 DIMM slots with two processors (12 DIMM slots per processor) per node. Each processor has 12 memory channels, with 1 DIMM per channel (DPC). Lenovo TruDDR5 RDIMMs, 3DS RDIMMs, and Value RDIMMs are supported, up to 4800 MHz
Persistent memory Not supported
Memory maximum Up to 3TB per node with 24x 128GB 3DS RDIMMs
Memory protection ECC, SDDC, Patrol/Demand Scrubbing, Bounded Fault, DRAM Address Command Parity with Replay, DRAM Uncorrected ECC Error Retry, On-die ECC, ECC Error Check and Scrub (ECS), Post Package Repair
Disk drive bays

Each node supports one of the following:

  • Up to 4x 7mm 2.5-inch drive bays supporting SATA or supporting PCIe 5.0 NVMe drives (but not both):
    • 4x 7mm drive bays with configurations without a PCIe slots
    • 2x 7mm drive bays with configurations with 1x PCIe slot
    • No 7mm drive bays with configuration with 2x PCIe slots (supports an M.2 drive)
  • Up to 2x 15mm 2.5-inch drive bay supporting a PCIe 5.0 NVMe drive
    • 2x 15mm drive bays with configurations without a PCIe slots
    • 1x 15mm drive bay with configurations with 1x PCIe slot
    • No 15mm drive bays with configuration with 2x PCIe slots (supports an M.2 drive)

Each node also supports one high-speed M.2 NVMe SSD with a PCIe 4.0 x4 connection, installed on an M.2 adapter mounted on top of the front processor

Note: Configurations with 2x PCIe slots only support the M.2 drive for internal storage

Maximum internal storage
  • 7mm drives
    • 30.72TB using 4x 7.68TB 7mm SATA SSDs
    • 15.36TB using 4x 3.84TB 7mm NVMe SSDs
  • 15mm drives
    • 7.68TB using 2x 3.84TB 15mm NVMe SSDs
Storage controllers
  • 2x Onboard SATA ports (no hardware RAID available)
  • 2x Onboard NVMe ports (no hardware RAID available)
Optical drive bays No internal bays; use an external USB drive.
Network interfaces Each node: 2x 25 Gb Ethernet SFP28 onboard connectors based on Mellanox ConnectX-6 Lx controller (support 10/25Gb), 1x 1 Gb Ethernet RJ45 onboard connector based on Intel I210 controller. Onboard 1Gb port and 25Gb port 1 can optionally be shared with the XClarity Controller 2 (XCC) management processor for Wake-on-LAN and NC-SI support.
PCIe slots Each node: 1x or 2x PCIe 5.0 x16 slots with low profile form factor
GPUs No support. NVIDIA HGX H100 4-GPU board is supported on the SD665-N V3 node.
Ports External diagnostics port, console connector (for a breakout cable that provides one VGA port, one USB 3.1 (5 Gb/s) port and one DB9 serial port for local connectivity). Additional ports provided by the enclosure as described in the Enclosure specifications section.
Video Embedded video graphics with 16 MB memory with 2D hardware accelerator, integrated into the XClarity Controller. Maximum resolution is 1920x1200 32bpp at 60Hz.
Security features Power-on password, administrator's password, Trusted Platform Module (TPM), supporting TPM 2.0. In China only, optional Nationz TPM 2.0 plug-in module (support is planned).
Systems management

Operator panel with status LEDs. Optional External Diagnostics Handset with LCD display. XClarity Controller 2 (XCC2) embedded management based on the ASPEED AST2600 baseboard management controller (BMC), XClarity Administrator centralized infrastructure delivery, XClarity Integrator plugins, and XClarity Energy Manager centralized server power management. Optional XCC Platinum to enable remote control functions and other features. Lenovo power/energy meter based on TI INA226 for 100Hz power measurements with >97% accuracy.

System Management Module (SMM2) in the DW612S enclosure provides additional systems management functions.

Operating systems supported

Red Hat Enterprise Linux, SUSE Linux Enterprise Server, and Ubuntu are Supported & Certified. Rocky Linux is Tested. See the Operating system support section for details and specific versions.

Limited warranty Three-year customer-replaceable unit and onsite limited warranty with 9x5 next business day (NBD).
Service and support Optional service upgrades are available through Lenovo Services: 4-hour or 2-hour response time, 6-hour fix time, 1-year or 2-year warranty extension, software support for Lenovo hardware and some third-party applications.
Dimensions Width: 438 mm (17.2 inches), height: 41 mm (1.6 inches), depth: 714 mm (28.1 inches)
Weight 23.6 kg (52.0 lb)

Standard specifications - DW612S enclosure

The ThinkSystem DW612S enclosure provides shared high-efficiency power supplies. The SD665 V3 servers connect to the midplane of the DW612S enclosure. This midplane connection is for power and control only; the midplane does not provide any I/O connectivity.

The following table lists the standard specifications of the enclosure.

Table 2. Standard specifications: ThinkSystem DW612S enclosure
Components Specification
Machine type 7D1L - 3-year warranty
Form factor 6U rack-mounted enclosure.
Maximum number of SD665 V3 nodes supported Up to 12x nodes per enclosure in 6x SD665 V3 server trays (2 nodes per tray).
Node support The DW612S supports all ThinkSystem V3 and V2 water-cooled systems (systems can coexist in the same DW612S enclosure). When mixing, install in the following order, from the bottom up: SD665-N V3, SD665 V3, SD650-I V3, SD650-N V2, SD650 V3, SD650 V2
Enclosures per rack Up to six DW612S enclosures per 42U rack and up to seven DW612S enclosures per 48U rack.
Midplane Passive midplane provides connections to the nodes in the front to the power supplies and fans at the rear. Provides signals to control fan speed, power consumption, and node throttling as needed.
System Management Module (SMM)

The hot-swappable System Management Module (SMM2) is the management device for the enclosure. Provides integrated systems management functions and controls the power and cooling features of the enclosure. Provides remote browser and CLI-based user interfaces for remote access via the dedicated Gigabit Ethernet port. Remote access is to both the management functions of the enclosure as well as the XClarity Controller (XCC) in each node.

The SMM has two Ethernet ports which enables a single incoming Ethernet connection to be daisy chained across 7 enclosures and 84 nodes, thereby significantly reducing the number of Ethernet switch ports needed to manage an entire rack of SD665 V3 nodes and enclosures.

Ports Two RJ45 port on the rear of the enclosure for 10/100/1000 Ethernet connectivity to the SMM for power and cooling management.
I/O architecture None integrated. Use top-of-rack networking and storage switches.
Power supplies 6x or 9x air-cooled hot-swap power supplies (2400W or 2600W), or 2x or 3x water-cooled hot-swap power supplies (7200W), depending on the power requirements of the installed server node trays. Power supplies installed at the rear of the enclosure. Single power domain supplies power to all nodes. Optional redundancy (N+1 or N+N) and oversubscription, depending on configuration and node population. Each power supply has an integrated fan. 80 PLUS Titanium or Platinum certified depending on the power supply. Built-in overload and surge protection.
Cooling Direct water cooling supplied by water manifolds connected from the rear of the enclosure.
System LEDs SMM has four LEDs: system error, identification, status, and system power. Each power supply has AC, DC, and error LEDs. Nodes have more LEDs.
Systems management Browser-based enclosure management through an Ethernet port on the SMM at the rear of the enclosure. Integrated Ethernet switch provides direct access to the XClarity Controller (XCC) embedded management of the installed nodes. Nodes provide more management features.
Temperature
  • Operating water temperature:
    • 2°C to 45°C (35.6°F to 113°F) (ASHRAE W45 compliant)
  • Operating air temperature:
    • 10°C - 35°C (50°F - 95°F) (ASHRAE A2 compliant)

See Operating Environment for more information.

Electrical power 200 V - 240 V ac input (nominal), 50 or 60 Hz
Power cords One C19 AC power cord for each air-cooled power supply
Three C19 AC power cords for each water-cooled power supply
Limited warranty Three-year customer-replaceable unit and onsite limited warranty with 9x5/NBD.
Dimensions Width: 447 mm (17.6 in.), height: 264 mm (10.4 in.), depth: 933 mm (36.7 in.). See Physical and electrical specifications for details.
Weight
  • Empty enclosure (with midplane and cables): 24.3 kg (53.5 lb)
  • Fully configured enclosure with 9x air-cooled power supplies and 6x SD665 V3 server trays: 182.9 kg (403 lb) (without water manifold)
  • Fully configured enclosure with 3x water-cooled power supplies and 6x SD665 V3 server trays: 188.7 kg (416 lb) (without water manifold)

Models

There are no standard SD665 V3 models; all servers must be configured by using the configure-to-order (CTO) process with the Lenovo Data Center Solution Configurator (DCSC) or the Lenovo Cluster Solutions configurator (x-config). The ThinkSystem SD665 V3 machine type is 7D9P.

The following table lists the base CTO model and base feature code

Table 3. Base CTO model
Machine Type/Model Description Feature code
7D9PCTOLWW ThinkSystem SD665 V3 Neptune DWC Tray (3-Year Warranty) BPT6

Enclosure models

There are no standard models of the DW612S enclosure. All enclosures must be configured by using the CTO process. The machine type is 7D1L.

The following table lists the base CTO model and base feature code

Table 4. Base CTO model
Machine Type/Model Description Feature code
7D1LCTO2WW ThinkSystem DW612S Neptune DWC Enclosure (3-Year Warranty) BMCA

Manifold assembly

The manifold provides the water supply and return to the DW612S Enclosure. It can be connected through the Eaton Ball Valves (Stainless steel V2A, Type FD83-2046-16-16) to a water loop in the data center that is connected to a centralized coolant distribution unit (CDU) or be ordered with an in-rack CDU.

DW612S enclosure and manifold assembly
Figure 8. DW612S enclosure and manifold assembly

The manifold is ordered using the CTO process in the configurators using machine type 5469. The following table lists the base CTO model.

Table 5. Base CTO model
Machine Type/Model Description
5469HC1 Lenovo Neptune DWC Node Manifold

The following table lists the base feature code for CTO configurations when connecting to a data center level water distribution. Select the correct feature code based on the number of enclosures installed in the rack. The feature code for the water-cooled power supplies (PSU) will be auto-derived when you select the PSUs in the configuration and is only supported with 6 Enclosures.

Table 6. Base feature code for CTO models
Feature code Description
Water manifolds for DW612S enclosure with fixed length hose connection
A5MN Neptune DWC Manifold Assembly for 1 Enclosure w/ 1.3m hose
A5N7 Neptune DWC Manifold Assembly for 2 Enclosures w/ 1.3m hose
BEZX Neptune DWC Manifold Assembly for 5 Enclosures w/ 2.3m hose
BEZW Neptune DWC Manifold Assembly for 6 Enclosures w/ 2.3m hose
BJAK Neptune DWC Manifold Assembly for 7 Enclosures w/ 2.3m hose
Additional water manifold for water-cooled power supplies
BN0S Neptune DWC Manifold Assembly for water-cooled Power Supplies

The following table lists the base feature code for CTO configurations when connecting to the in-rack CDU.

Table 7. Base feature code for CTO models
Feature code Description
Water manifolds for DW612S enclosure with configurable hose connection for use with in-rack CDU
BRGP Neptune DWC Manifold Assembly for 1 Enclosure
BRGN Neptune DWC Manifold Assembly for 2 Enclosure
BRGM Neptune DWC Manifold Assembly for 5 Enclosure
BRGL Neptune DWC Manifold Assembly for 6 Enclosure
Additional water manifold for water-cooled power supplies for use with in-rack CDU
BRGQ Neptune DWC Manifold Assembly for water-cooled Power Supplies with in-rack CDU

To support the onsite setup for the direct water-cooled solution, a Commissioning Kit is available providing flow meter, bleed hose, pressure gauge and vent valve to Lenovo partners and customers.

Table 8. Commissioning Kit
Feature code Description
4XF7A84654 Neptune DWC Manifold Commissioning Kit

For additional information, see the Cooling section.

In-rack CDU assembly

The RM100 In-Rack Coolant Distribution Unit (CDU) can provide 100kW cooling capacity within the rack cabinet. It is designed as a 4U high rack device installed at the bottom of the rack. Rack support is as follows:

  • 42U rack cabinet: In-Rack CDU with 5 enclosures; no support for water-cooled power supplies
  • 48U rack cabinet: In-Rack CDU with 6 enclosures; supports water-cooled power supplies

For information about the 42U and 48U Heavy Duty Rack Cabinets, see the product guide:
https://lenovopress.lenovo.com/lp1498-lenovo-heavy-duty-rack-cabinets

The following figure shows the RM100 CDU.

RM100 In-Rack Coolant Distribution Unit
Figure 9. RM100 In-Rack Coolant Distribution Unit

The CDU can be ordered using the CTO process in the configurators using machine type 7DBL. The following table lists the base CTO model and base feature code.

Table 9. DW612S In-rack CDU assembly
CTO model Base feature Description
7DBLCTOLWW BRL4 Lenovo Neptune DWC RM100 In-Rack CDU

For more details and exact specification of the CDU, see the In-Rack CDU page in the ThinkSystem Information Center:
https://thinksystem.lenovofiles.com/help/index.jsp?topic=%2Fhdc_rackcabinet%2Fcdu_manifold_config_42u.html

The following table lists additional feature codes for CTO configurations. They will be auto-derived when you select the in-Rack CDU for the configuration.

Table 10. Base feature code for CTO models
Feature code Description Purpose
BRM4 Neptune DWC In-Rack CDU Connection Assembly for DWC Manifold Assembly to connect in-rack CDUs to Enclosure and Power Supply Manifolds
BRM3 Neptune DWC In-Rack CDU 2.3m Primary Loop Connection Hose Hose to connect in-rack CDU to the primary datacenter waterloop
BRL3 Neptune DWC In-Rack CDU Filler Kit Hose to connect to the in-rack CDU for easy filling with water

Processors

The SD665 V3 supports processors in the fourth-generation AMD EPYC family of processors. The node supports two processors. The use of only one processor in the node is not supported.

Topics in this section:

Processor options

The table below lists the AMD processors that are currently supported by the SD665 V3.

All supported processors have the following characteristics:

  • Fourth-generation AMD EPYC processors (formerly codenamed "Genoa")
  • 5 nm process technology
  • 12 DDR5 memory channels
  • 128 PCIe 5.0 I/O lanes, 64 lanes available for PCIe and NVMe devices
Table 11. SD665 V3 processor support
Feature
code
SKU Description Quantity
supported
BREE 9124 ThinkSystem AMD EPYC 9124 16C 200W 3.0GHz Processor 2
BREJ 9174F ThinkSystem AMD EPYC 9174F 16C 320W 4.1GHz Processor 2
BREH 9224 ThinkSystem AMD EPYC 9224 24C 200W 2.5GHz Processor 2
BRED 9254 ThinkSystem AMD EPYC 9254 24C 200W 2.9GHz Processor 2
BREF 9274F ThinkSystem AMD EPYC 9274F 24C 320W 4.05GHz Processor 2
BREC 9334 ThinkSystem AMD EPYC 9334 32C 210W 2.7GHz Processor 2
BR30 9354 ThinkSystem AMD EPYC 9354 32C 280W 3.25GHz Processor 2
BR32 9374F ThinkSystem AMD EPYC 9374F 32C 320W 3.85GHz Processor 2
BREB 9454 ThinkSystem AMD EPYC 9454 48C 290W 2.75GHz Processor 2
BR31 9474F ThinkSystem AMD EPYC 9474F 48C 360W 3.6GHz Processor 2
BREA 9534 ThinkSystem AMD EPYC 9534 64C 280W 2.45GHz Processor 2
BPVJ 9554 ThinkSystem AMD EPYC 9554 64C 360W 3.1GHz Processor 2
BR2Z 9634 ThinkSystem AMD EPYC 9634 84C 290W 2.25GHz Processor 2
BPVK 9654 ThinkSystem AMD EPYC 9654 96C 360W 2.4GHz Processor 2

Configuration notes:

  • Single-processor configurations are not supported

Processor features

The following table lists the features of the supported processors.

Table 12. Processor specifications
EPYC
model
Cores /
Threads
Base
Frequency
Max Boost
Frequency†
L3 Cache Memory
channels
Memory
bus
TDP
9124 16C 3.0 GHz 3.7 GHz 64 MB 12 4800 MHz 200W
9174F 16C 4.1 GHz 4.4 GHz 256 MB 12 4800 MHz 320W
9224 24C 2.5 GHz 3.7 GHz 64 MB 12 4800 MHz 200W
9254 24C 2.9 GHz 4.15 GHz 128 MB 12 4800 MHz 200W
9274F 24C 4.05 GHz 4.3 GHz 256 MB 12 4800 MHz 320W
9334 32C 2.7 GHz 3.9 GHz 128 MB 12 4800 MHz 210W
9354 32C 3.25 GHz 3.8 GHz 256 MB 12 4800 MHz 280W
9374F 32C 3.85 GHz 4.3 GHz 256 MB 12 4800 MHz 320W
9454 48C 2.75 GHz 3.8 GHz 256 MB 12 4800 MHz 290W
9474F 48C 3.6 GHz 4.1 GHz 256 MB 12 4800 MHz 360W
9534 64C 2.45 GHz 3.7 GHz 256 MB 12 4800 MHz 280W
9554 64C 3.1 GHz 3.75 GHz 256 MB 12 4800 MHz 360W
9634 84C 2.25 GHz 3.7 GHz 384 MB 12 4800 MHz 290W
9654 96C 2.4 GHz 3.7 GHz 384 MB 12 4800 MHz 360W

† The maximum single-core frequency at with the processor is capable of operating

UEFI operating modes

The SD665 V3 offers preset operating modes that affect energy consumption and performance. These modes are a collection of predefined low-level UEFI settings that simplify the task of tuning the server to suit your business and workload requirements.

The following table lists the feature codes that allow you to specify the mode you wish to preset in the factory for CTO orders.

Table 13. UEFI operating mode presets in DCSC
Feature code Description
BFYA Operating mode selection for: "Maximum Efficiency Mode"
BFYB Operating mode selection for: "Maximum Performance Mode"

The preset modes for the SD665 V3 are as follows:

  • Maximum Efficiency Mode (feature BFYA): Maximizes performance/watt efficiency while maintaining reasonable performance
  • Maximum Performance Mode (feature BFYB): Achieves maximum performance but with higher power consumption and lower energy efficiency.

For details about these preset modes, and all other performance and power efficiency UEFI settings offered in the SD665 V3, see the paper "Tuning UEFI Settings for Performance and Energy Efficiency on AMD Processor-Based ThinkSystem Servers", available from https://lenovopress.lenovo.com/lp1267.

Memory

The SD665 V3 uses Lenovo TruDDR5 memory operating at up to 4800 MHz. The server supports up to 24 DIMMs with 2 processors. The processors have 12 memory channels and support 1 DIMM per channel. The server supports up to 3TB of memory using 24x 128GB 3DS RDIMMs and two processors.

The following table lists the memory options that are available for the server.

Lenovo TruDDR5 memory uses the highest quality components that are sourced from Tier 1 DRAM suppliers and only memory that meets the strict requirements of Lenovo is selected. It is compatibility tested and tuned to maximize performance and reliability. From a service and support standpoint, Lenovo TruDDR5 memory automatically assumes the system warranty, and Lenovo provides service and support worldwide.

Table 14. Memory options
Part number Feature code Description
DDR5 9x4 RDIMMs - 4800 MHz
4X77A81442 BQ36 ThinkSystem 64GB TruDDR5 4800MHz (2Rx4) 9x4 RDIMM-A
DDR5 10x4 RDIMMs - 4800 MHz
4X77A81437 BQ3C ThinkSystem 16GB TruDDR5 4800MHz (1Rx8) RDIMM-A
4X77A81440 BQ37 ThinkSystem 32GB TruDDR5 4800MHz (2Rx8) RDIMM-A
DDR5 10x4 3DS RDIMMs - 4800 MHz
4X77A81443 BQ3A ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM-A

9x4 RDIMMs (also known as Optimized or EC4 RDIMMs) are a new lower-cost DDR5 memory option supported in ThinkSystem V3 servers. 9x4 DIMMs offer the same performance as standard RDIMMs (known as 10x4 or EC8 modules), however they support lower fault-tolerance characteristics. Standard RDIMMs and 3DS RDIMMs support two 40-bit subchannels (that is, a total of 80 bits), whereas 9x4 RDIMMs support two 36-bit subchannels (a total of 72 bits). The extra bits in the subchannels allow standard RDIMMs and 3DS RDIMMs to support Single Device Data Correction (SDDC), however 9x4 RDIMMs do not support SDDC. Note, however, that all DDR5 DIMMs, including 9x4 RDIMMs, support Bounded Fault correction, which enables the server to correct most common types of DRAM failures.

For more information on DDR5 memory, see the Lenovo Press paper, Introduction to DDR5 Memory, available from https://lenovopress.com/lp1618.

The following rules apply when selecting the memory configuration:

  • The SD665 V3 only supports quantities of 8 or 12 DIMMs per processor; other quantities not supported
  • 128GB DIMMs require a water inlet temperature of 32°C or less
  • The server supports three types of DIMMs: 9x4 RDIMMs, 10x4 RDIMMs, and 3DS RDIMMs; UDIMMs and LRDIMMs are not supported
  • All memory DIMMs must be identical part numbers
  • Memory mirroring and memory rank sparing are not supported.

For best performance, consider the following:

  • Ensure the memory installed is at least the same speed as the memory bus of the selected processor.
  • Populate all 12 memory channels.

The following memory protection technologies are supported:

  • ECC detection/correction
  • Bounded Fault detection/correction
  • SDDC (for x4-based memory DIMMs; look for "x4" in the DIMM description. Not supported with 9x4 RDIMMs)
  • Patrol/Demand Scrubbing
  • DRAM Address Command Parity with Replay
  • DRAM Uncorrected ECC Error Retry
  • On-die ECC
  • ECC Error Check and Scrub (ECS)
  • Post Package Repair

GPU accelerators

GPUs are not supported in the SD665 V3.

For NVIDIA H100 GPU support in a water-cooled solution, the ThinkSystem SD665-N V3 node leverages the identical SD665 V3 node integrating a NVIDIA HGX H100 4-GPU board. For details, see the SD665-N V3 product guide, https://lenovopress.com/LP1613.

Internal storage

The SD665 V3 node supports up to four SSDs drives internally in the node. These are internal drives that are not front accessible and are not hot-swap. See the Components and connectors section for the location of the drives. Drives are installed in one or both of the bays towards of the front of the node, mutually exclusive with the PCIe slots.

In each bay, the node supports either:

  • One PCIe low-profile adapter
  • 2x 2.5-inch 7mm drives
  • 1x 2.5-inch 15mm drives

Without any PCIe adapter slots, the node supports either 2x 15mm drives or 4x 7mm drives.

Configuration notes:

  • The node supports NVMe drives or SATA drives but not both; SAS drives are not supported
  • The drives are connected to onboard controllers; RAID functionality is provided by the operating system.
  • NVMe drives are connected to CPU 1 in all configurations
  • When 4x 7mm drives are installed in a node, they are numbered drive 0, 1, 2, and 3. When 2x 15mm drives are installed, they are numbered 0 and 2.

In addition, the SD665 V3 node a single high-performance M.2 NVMe drive, installed in an adapter mounted on top of the front processor. For details, see the M.2 drive section.

The feature codes to select the appropriate storage cage are listed in the following table:

Table 15. Drive cage feature codes
Part number Feature code Description
CTO only BPZB ThinkSystem SD665, SD665-N V3 1x2.5" 15mm NVMe/SATA Storage Cage
CTO only BPZA ThinkSystem SD665, SD665-N V3 2x2.5" 7mm NVMe/SATA Storage Cage

The necessary storage cables are auto-derived by the configurator based on the selection, as listed in the following table.

Table 16. Internal storage
Part number Feature code Description
Cables to connect Storage from Bay 1 – default selection with one adapter
CTO Only BPZD ThinkSystem SD665 V3 SATA Cable
CTO only BPZE ThinkSystem SD665 V3 NVMe Cable for U.2/U.3
Cables to connect Storage from Bay 2 – leveraged in full storage configuration
CTO Only BPZC ThinkSystem SD665 V3 NVMe/SATA Cable for 2.5" Storage in Bay 2

To upgrade systems installed in the field with storage options, there are separate kits available that contain both the cage and the necessary cables. The option part numbers of the upgrade kits are listed in the following table:

Table 17. Drive cage field upgrades
Part number Description
4XF7A83363 ThinkSystem SD665 V3 NVMe Storage Option Upgrade Kit
4XF7A83362 ThinkSystem SD665 V3 SATA Storage Option Upgrade Kit

M.2 drive

The SD665 V3 supports one M.2 form-factor NVMe drive for use as an operating system boot solution. The M.2 drive installs into an M.2 adapter which is mounted on top of the front processor in the node. See the internal view of the node in the Components and connectors section for the location of the M.2 drive.

PCIe x4 interface: In the SD665 V3, the M.2 drive is connected to the processor using a PCIe x4 connection, which enables the M.2 drive to operate at the highest performance.

Components and location of the M.2 enablement kit
Figure 10. Components and location of the M.2 enablement kit

The ordering information of the M.2 adapter is listed in the following table. Supported drives are listed in the Internal drive options section.

Table 18. M.2 adapter
Part number Feature code Description Maximum
supported
CTO only BPZF ThinkSystem SD665, SD665-N V3 DWC M.2 Enablement Kit 1

Note: In the SD665 V3, the M.2 adapter only supports NVMe drives. SATA M.2 drives are not supported

The M.2 enablement kit has the following features:

  • Supports one NVMe M.2 drive
  • Supports 80mm and 110mm drive form factors (2280 and 22110)
  • PCIe 4.0 x4 NVMe interface to the drive
  • Connects to CPU 1 via onboard NVMe connector
  • Supports monitoring and reporting of events and temperature through I2C
  • Firmware update via Lenovo firmware update tools
  • Water-cooled via the attached cold plate

Controllers for internal storage

The drives of the SD665 V3 are connected to integrated SATA and NVMe storage controllers:

  • Onboard 6Gb SATA ports
  • Onboard PCIe x4 NVMe ports

The node hardware does not provide any RAID functionality. RAID support is provided by the operating system.

Internal drive options

The following tables list the drive options for internal storage of the node.

M.2 drive support: The use of M.2 drives requires an additional adapter as described in the M.2 drives subsection.

SED support: The tables include a column to indicate which drives support SED encryption. The encryption functionality can be disabled if needed. Note: Not all SED-enabled drives have "SED" in the description.

Table 19. 7mm 2.5-inch trayless 6 Gb SATA SSDs
Part number Feature
code
Description SED
support
Max
Qty
7mm 2.5-inch trayless SSDs - 6 Gb SATA - Mixed Use/Mainstream (3-5 DWPD)
4XB7A77060 BKSX ThinkSystem 2.5" 7mm S4620 480GB Mixed Use SATA 6Gb Trayless SSD Support 4
4XB7A77061 BKSY ThinkSystem 2.5" 7mm S4620 960GB Mixed Use SATA 6Gb Trayless SSD No 4
4XB7A77062 BKSZ ThinkSystem 2.5" 7mm S4620 1.92TB Mixed Use SATA 6Gb Trayless SSD No 4
4XB7A78629 BM1F ThinkSystem 2.5" 7mm S4620 3.84TB Mixed Use SATA 6Gb Trayless SSD No 4
7mm 2.5-inch trayless SSDs - 6 Gb SATA - Read Intensive/Entry (<3 DWPD)
4XB7A77056 BKST ThinkSystem Intel S4520 2.5" 7mm 240GB Entry SATA 6Gb Non-Hot Swap SSD Trayless No 4
4XB7A77057 BKSU ThinkSystem Intel S4520 2.5" 7mm 480GB Entry SATA 6Gb Non-Hot Swap SSD Trayless No 4
4XB7A77058 BKSV ThinkSystem 2.5" 7mm S4520 960GB Read Intensive SATA 6Gb Trayless SSD No 4
4XB7A77059 BKSW ThinkSystem 2.5" 7mm S4520 1.92TB Read Intensive SATA 6Gb Trayless SSD No 4
4XB7A78627 BM1D ThinkSystem 2.5" 7mm S4520 3.84TB Read Intensive SATA 6Gb Trayless SSD No 4
4XB7A78628 BM1E ThinkSystem 2.5" 7mm S4520 7.68TB Read Intensive SATA 6Gb Trayless SSD No 4
Table 20. 7mm 2.5-inch trayless PCIe 4.0 NVMe SSDs
Part number Feature
code
Description SED
support
Max
Qty
7mm 2.5-inch SSDs - U.3 PCIe 4.0 NVMe - Read Intensive/Entry (<3 DWPD)
4XB7A13975 BKSQ ThinkSystem 2.5" 7mm U.3 7450 PRO 960GB Read Intensive NVMe PCIe 4.0 x4 Trayless SSD Support 4
4XB7A13976 BKWR ThinkSystem 2.5" 7mm U.3 7450 PRO 1.92TB Read Intensive NVMe PCIe 4.0 x4 Trayless SSD Support 4
4XB7A13977 BKWS ThinkSystem 2.5" 7mm U.3 7450 PRO 3.84TB Read Intensive NVMe PCIe 4.0 x4 Trayless SSD Support 4
Table 21. 15mm 2.5-inch trayless PCIe 4.0 NVMe SSDs
Part number Feature
code
Description SED
support
Max
Qty
15mm 2.5-inch SSDs - U.2 PCIe 4.0 NVMe - Mixed Use/Mainstream (3-5 DWPD)
4XB7A76781 BKT5 ThinkSystem 2.5" 15mm U.2 P5620 1.6TB Mixed Use NVMe PCIe 4.0 x4 Trayless SSD Support 2
4XB7A76782 BKT6 ThinkSystem 2.5" 15mm U.2 P5620 3.2TB Mixed Use NVMe PCIe 4.0 x4 Trayless SSD Support 2
15mm 2.5-inch SSDs - U.2 PCIe 4.0 NVMe - Read Intensive/Entry (<3 DWPD)
4XB7A76780 BKT4 ThinkSystem 2.5" 15mm U.2 P5520 1.92TB Read Intensive NVMe PCIe 4.0 x4 Trayless SSD Support 2
4XB7A17124 BA7P ThinkSystem 2.5" 15mm U.2 P5520 3.84TB Read Intensive NVMe PCIe 4.0 x4 Trayless SSD Support 2
Table 22. M.2 PCIe 4.0 NVMe drives
Part number Feature
code
Description SED
support
Max
Qty
M.2 SSDs - PCIe 4.0 NVMe - Read Intensive/Entry (<3 DWPD)
4XB7A13999 BP27 ThinkSystem M.2 7450 PRO 960GB Read Intensive NVMe PCIe 4.0 x4 NHS SSD Support 1

Optical drives

The server supports the external USB optical drive listed in the following table.

Table 23. External optical drive
Part number Feature code Description
7XA7A05926 AVV8 ThinkSystem External USB DVD RW Optical Disk Drive

The drive is based on the Lenovo Slim DVD Burner DB65 drive and supports the following formats: DVD-RAM, DVD-RW, DVD+RW, DVD+R, DVD-R, DVD-ROM, DVD-R DL, CD-RW, CD-R, CD-ROM.

I/O expansion options

The SD665 V3 supports 1x or 2x slots depending on the configuration:

  • 1x PCIe 5.0 x16 slot with support for 2x 7mm or 1x 15mm 2.5-inch drive
  • 2x PCIe 5.0 x16 slots without 2.5-inch drive support

The location of the slots is shown in the following figure.

SD665 V3 slot choices
Figure 11. SD665 V3 slot choices

Both slots are implemented using a 1-slot riser. Ordering information is in the following table.

Table 24. Riser ordering information
Part number Feature code Description Maximum
supported
Riser for slot 2 (connects to CPU 1)
CTO only BPT4 ThinkSystem SD665 V3 1U PCIe Riser 1
Riser for slot 1 (connects to CPU 2)
CTO only BPT5 ThinkSystem SD665 V3 BalancedIO Riser 1

Network adapters

The SD665 V3 has three onboard network ports as well as support for up to two PCIe adapters.

Topics in this section:

Onboard ports

The SD665 V3 has three onboard network ports:

  • 2x 25GbE ports, connected to an onboard Mellanox ConnectX-6 Lx controller, implemented with SFP28 cages for optical or copper connections. Supports 1Gb, 10Gb and 25Gb connections.
  • 1x 1GbE port, connected to an onboard Intel I210 controller, implemented with an RJ45 port for copper cabling

Locations of these ports is shown in the Components and connectors section. The 1GbE port and 25GbE Port 1 both support NC-SI for remote management. For factory orders, to specify which ports should have NC-SI enabled, use the feature codes listed in the Remote Management section. If neither is chosen, both ports will have NC-SI disabled by default.

For the specifications of the 25GbE ports including the supported transceivers and cables, see the Mellanox ConnectX-6 Lx product guide:
https://lenovopress.lenovo.com/lp1364-thinksystem-mellanox-connectx-6-lx-25gbe-sfp28-ethernet-adapters

Network adapters

The SD665 V3 supports one or two network adapters installed in the PCIe slots. The following table lists the supported adapters. The node supports the SharedIO or Socket Direct features as indicated in the table.

Table 25. PCIe network adapters and internal cables
Part number Feature
code
Description Supported connections*
Standalone
adapter
SharedIO Socket
Direct
Adapters
4XC7A86671 BKSN ThinkSystem NVIDIA ConnectX-7 NDR OSFP400 1-port PCIe Gen5 x16 InfiniBand Adapter DWC Yes (2 max) No Yes (1 max)
4XC7A86670 BKSP ThinkSystem NVIDIA ConnectX-7 NDR OSFP400 1-port PCIe Gen5 x16 InfiniBand Adapter (SharedIO) DWC No Yes (1 per tray) No
4XC7A86669 BKSL ThinkSystem NVIDIA ConnectX-7 NDR200/HDR QSFP112 2-port PCIe Gen5 x16 InfiniBand Adapter (SharedIO) DWC Yes (2 max) Yes (1 per tray) No
4XC7A86672 BKSK ThinkSystem Mellanox ConnectX-6 HDR/200GbE QSFP56 1-Port PCIe 4 VPI Adapter (SharedIO) DWC Yes (2 max) Yes (1 per tray)† No
Internal cables
CTO only BPZG ThinkSystem SD665 V3 SharedIO Cable No Yes (1 per tray) No
CTO only BPZH ThinkSystem SD665 V3 Socket-Direct Cable No No Yes (1)

* Numbers in parenthesis are the maximum supported per node for that configuration, except for the ShareIO quantities, which are maximums per tray (2 nodes)
† The ConnectX-6 adapter is not supported in SharedIO mode if water-cooled power supplies are configured

For more information, including the transceivers and cables that each adapter supports, see the list of Lenovo Press Product Guides in the Networking adapters category:
https://lenovopress.com/servers/options/ethernet

Shared I/O

The SD665 V3 supports a feature called Shared I/O (SharedIO), also known as NVIDIA Networking Multi-Host technology, where a single network connection is shared between the two nodes in a tray. With Shared I/O, the NVIDIA adapter (feature BKSL, BKSP or BKSK) is installed in one node in a tray, and a SharedIO cable (feature BPZG) is used to connect the adapter to a PCIe connector on the adjacent node in the same tray. The result is that the two nodes share the network connection of the adapter with significant savings both in the cost of the adapters but also the cost of switch ports.

Configuration rules:

  • Shared I/O requires the use of SharedIO cable (feature BPZG)
  • The adapter must be installed in Slot 2 of node 2. The cable connects the adapter to the onboard connector for Slot 2 of node 1
  • Slot 1 of each node can be configured for storage, either 2x 7mm drives or 1x 15mm drive per node

Tip: The ConnectX-7 NDR200/HDR adapter (feature BKSL) and the ConnectX-6 HDR/200GbE adapter (feature BKSK) can be used either standalone (maximum 2 per node or 4 per tray) or as part of a Shared I/O configuration (maximum 1 per tray).

Socket Direct

The SD665 V3 also supports a feature called Socket Direct where an adapter installed in a node is connected to both processors in that node at the same time. Socket Direct enables direct PCIe access to both processors, eliminating the need for network traffic having to traverse the inter-process bus. This optimizes overall system performance and maximum throughput for the most demanding applications and markets.

In the SD665 V3, this is achieved by installing the NVIDIA adapter in slot 2 (connects to CPU 1) and a Socket Direct cable (feature BPZH) is used to connect the adapter to the PCIe connector for slot 1 (which connects to CPU 2).

Configuration rules:

  • Socket Direct requires the use of Socket Direct cable (feature BPZH)
  • The adapter must be installed in Slot 2 of each node. The cable connects the adapter to the onboard connector for Slot 1
  • Slot 1 must remain empty if Socket Direct is configured
  • Socket Direct only operates at PCIe Gen 4 speed, however the adapter operates at Gen 4 speed on each link, thus matching total Gen 5 speed.

Storage host bus adapters

The SD665 V3 does not support storage host bus adapters.

Flash storage adapters

The SD665 V3 does not support Flash storage adapters.

Cooling

One of the most notable features of the ThinkSystem SD665 V3 offering is direct water cooling. Direct water cooling (DWC) is achieved by circulating the cooling water directly through cold plates that contact the CPU thermal case, DIMMs, and other high-heat-producing components in the node.

One of the main advantages of direct water cooling is the water can be relatively warm and still be effective because water conducts heat much more effectively than air. Depending on the server and power supply configuration as well as environmentals like water and air temperature, effectively 100% of the heat can be removed by water cooling; in configurations that stay slightly below that, the rest can be easily managed by a standard computer room air conditioner. Measured data at a customer data center shows 98% heat capture at 45°C water inlet temperature and 99% heat capture at 40°C water inlet temperature and 26.6°C ambient temperature with insulated racks using the SD650-N V2.

Allowable inlet temperatures for the water can be as high as 45°C (113°F) with the SD665 V3. In most climates, water-side economizers can supply water at temperatures below 45°C for most of the year. This ability allows the data center chilled water system to be bypassed thus saving energy because the chiller is the most significant energy consumer in the data center. Typical economizer systems, such as dry-coolers, use only a fraction of the energy that is required by chillers, which produce 6-10 °C (43-50 °F) water. The facility energy savings are the largest component of the total energy savings that are realized when the SD665 V3 is deployed.

The advantages of the use of water cooling over air cooling result from water’s higher specific heat capacity, density, and thermal conductivity. These features allow water to transmit heat over greater distances with much less volumetric flow and reduced temperature difference as compared to air.

For cooling IT equipment, this heat transfer capability is its primary advantage. Water has a tremendously increased ability to transport heat away from its source to a secondary cooling surface, which allows for large, more optimally designed radiators or heat exchangers rather than small, inefficient fins that are mounted on or near a heat source, such as a CPU.

The ThinkSystem SD665 V3 offering uses the benefits of water by distributing it directly to the highest heat generating node subsystem components. By doing so, the offering realizes 7% - 10% direct energy savings when compared to an air-cooled equivalent. That energy savings results from the removal of the system fans and the lower operating temp of the direct water-cooled system components.

The direct energy savings at the enclosure level, combined with the potential for significant facility energy savings, makes the SD665 V3 an excellent choice for customers that are burdened by high energy costs or with a sustainability mandate.

Water is delivered to each of the nodes from a coolant distribution unit (CDU) via the water manifold. As shown in the following figure, each manifold section attaches to an enclosure and connects directly to the water inlet and outlet connectors for each compute node to deliver water safely and reliably to and from each server tray.

The DWC Manifold is modular and is available in multiple configurations that are based on the number of enclosure drops that are required in a rack. The Manifold scales to support up to six Enclosures in a single rack, as shown in the following figure. Ordering information for the water manifold is in the Manifold assembly section.

DW612S enclosure and manifold assembly
Figure 12. DW612S enclosure and manifold assembly

The water flows through the SD665 V3 tray to cool all major heat-producing components. The inlet water is split into two parallel paths, one for each node in the tray. Each path is then split further to cool the processors, memory, drives (including the M.2 drive) and adapters.

When the DW612S is configured with water-cooled power supplies, an additional water manifold is used to supply water to each of the three power supplies, as shown in the following figure. Ordering information for the manifold is in the Manifold assembly section.

DW612S enclosure with water-cooled power supplies and manifold
Figure 13. DW612S enclosure with water-cooled power supplies and manifold

During the manufacturing and test cycle, Lenovo’s water-cooled nodes are pressure tested with Helium according to ASTM E499 / E499M – 11 (Standard Practice for Leaks Using the Mass Spectrometer Leak Detector in the Detector Probe Mode) and later again with Nitrogen to detect micro-leaks which may be undetectable by pressure testing with water and/or a water/glycol mixture as Helium and Nitrogen have smaller molecule sizes.

This approach also allows Lenovo to ship the systems pressurized without needing to send hazardous antifreeze-components to our customers.

Onsite the materials used within the water loop from the CDU to the nodes should be limited to copper alloys with brazed joints, Stainless steels with TIG and MIG welded joints and EPDM rubber. In some instances, PVC might be an acceptable choice within the facility.

The water the system is filled with must be reasonably clean, bacteria-free water (< 100 CFU/ml) such as de-mineralized water, reverse osmosis water, de-ionized water, or distilled water. It must be filtered with in-line 50 micron filter. Biocide and Corrosion inhibitors ensure a clean operation without microbiological growth or corrosion.

Lenovo Data Center Power and Cooling Services can support you in the design, implementation and maintenance of the facility water-cooling infrastructure. 

Power supplies

The DW612S enclosure supports air-cooled or water-cooled power supplies. The use of water-cooled power supplies enables an even greater amount of heat can be removed from the data center using water instead of air-conditioning.

The DW612S supports the following power supply quantities, however the power needs depend on the power requirements of the installed server node trays:

  • 6x or 9x air-cooled power supplies, each with 1x C19 power connector
  • 2x or 3x water-cooled power supplies, each with 3x C19 power connectors

Tip: Use Lenovo Capacity Planner to determine the power needs for your rack installation. See the Lenovo Capacity Planner section for details.

The power supplies provide N+1 redundancy, depending on population and configuration of the node trays. Power policies with no redundancy also are supported.

Topics in this section:

Power supply layout

Power supplies are implemented in the DW612S enclosure in vertical cages, with three air-cooled power supplies or one water-cooled power supply in each cage. The following figure shows nine air-cooled power supplies installed in three cages.

Power supplies and cages in the DW612S enclosure
Figure 14. Power supplies and cages in the DW612S enclosure (shown with 9 air-cooled power supplies)

The following figure shows the DW612S with three water-cooled power supplies installed.

Power supplies and cages in the DW612S enclosure
Figure 15. Power supplies and cages in the DW612S enclosure (shown with 3 water-cooled power supplies)

For configurations with six air-cooled power supplies, you can specify whether you want 3 power supplies in each of 2 cages, or you can specify if you want 2 power supplies installed in each of 3 cages. The latter means that you can later upgrade the enclosure to a total of 9 power supplies by adding one more power supply to each cage.

The following table lists the supported power supply configurations.

Table 26. Power supply cage configuration choices
Feature code Description
BF7J ThinkSystem DW612 2 PSU Cage with 6 PSU Configuration
BF7K ThinkSystem DW612 3 PSU Cage with 6 PSU Configuration
BF7L ThinkSystem DW612 3 PSU Cage with 9 PSU Configuration

Ordering information

The following table lists the supported power supplies for use in the DW612S enclosure with SD665 V3 nodes installed. Mixing of power supply capacities (different part number) is not supported.

Table 27. Power supply options
Part number Feature Description Connector Quantity
support
80 PLUS 110V AC 220V AC 240V DC
China only
Air cooled power supplies
4P57A69999 BF7M ThinkSystem DW612 2400W (230V) Platinum Hot-Swap Power Supply 1x C19 6, 9 Platinum No Yes Yes
4P57A72667 BKTJ ThinkSystem 2600W 230V Titanium Hot-Swap Gen2 Power Supply  1x C19 6, 9 Titanium No Yes Yes
Water cooled power supplies
4P57A72669 BKTK ThinkSystem DW612S 7200W 230V Titanium Power Supply 3x C19 2, 3 Titanium No Yes Yes

The power supply units have the following features:

  • 80 PLUS Platinum or Titanium certified as listed in the table above
  • Supports N+1 power redundancy or non-redundant power configurations
  • Power management configured through the SMM
  • Integrated 2500 RPM fan
  • Built-in overload and surge protection
  • Supports high-range voltage only: 200 - 240 V

Power output

The power rating of each power supply (eg 2400W or 2600W) is dependent on the voltage of the input supply. A 208V supply will be able to generate less power than a 240V supply for example. You will need to take this into consideration when determining your power needs. The following table provides the details for each supported power supply unit. A yellow cell indicates lower power availability than the rated power.

Table 28. Power availability based on the voltage of the supply
Description 2400W 230V Platinum
Power Supply
2600W 230V Titanium
Power Supply
7200W 230V Titanium
Power Supply
Power Rating 2400W 2600W 7200W
Output with 200-208Vac supply 2400W 2400W 6900W
Output with 220-240Vac supply 2400W 2600W 7200W

Power cables

The power supplies in the DW612S enclosure have C19 connectors and support the following rack power cables.

Table 29. C19 rack power cables
Part number Feature code Description
4L67A86677 BPJ0 0.5m, 16A/100-250V, C19 to IEC 320-C20 Rack Power Cable
4L67A86678 B4L0 1.0m, 16A/100-250V, C19 to IEC 320-C20 Rack Power Cable
4L67A86679 B4L1 1.5m, 16A/100-250V, C19 to IEC 320-C20 Rack Power Cable
4L67A86680 B4L2 2.0m, 16A/100-250V, C19 to IEC 320-C20 Rack Power Cable
39Y7916 6252 2.5m, 16A/100-250V, C19 to IEC 320-C20 Rack Power Cable
4L67A86681 B4L3 4.3m, 16A/100-250V, C19 to IEC 320-C20 Rack Power Cable

System Management

The SD665 V3 contains an integrated service processor, XClarity Controller 2 (XCC), which provides advanced control, monitoring, and alerting functions. The XCC2 is based on the AST2600 baseboard management controller (BMC) using a dual-core ARM Cortex A7 32-bit RISC service processor running at 1.2 GHz.

Topics in this section:

Local console

The SD665 V3 node supports a local console with the use of a console breakout cable. The cable connects to the port on the front of the node as shown in the following figure.

Console breakout cable
Figure 16. Console breakout cable

The cable has the following connectors:

  • VGA port
  • Serial port
  • USB 3.1 Gen 1 (5 Gb/s) port

Tip: USB 3.0 was renamed to USB 3.1 Gen 1 by the USB Implementers Forum. The terms "USB 3.0" and "USB 3.1 Gen 1" are used interchangeably - both offer a 5 Gb/s USB connection.

As well as local console functions, the USB port on the breakout cable also supports the use of the XClarity Mobile app as described in the next section.

Ordering information for the cable is listed in the following table.

Table 30. Console breakout cable ordering information
Part number Feature code Description
4X97A83213 1410 BMJB ThinkSystem USB 3.0 Console Breakout Cable for Dense Systems v2

External Diagnostics Handset

The SD665 V3 has a port to connect an External Diagnostics Handset as shown in the following figure.

The External Diagnostics Handset allows quick access to system status, firmware, network, and health information. The LCD display on the panel and the function buttons give you access to the following information:

  • Active alerts
  • Status Dashboard
  • System VPD: machine type & mode, serial number, UUID string
  • System firmware levels: UEFI and XCC firmware
  • XCC network information: hostname, MAC address, IP address, DNS addresses
  • Environmental data: Ambient temperature, CPU temperature, AC input voltage, estimated power consumption
  • Active XCC sessions
  • System reset action

The handset has a magnet on the back of it to allow you to easily mount it on a convenient place on any rack cabinet.

SD665 V3 External Diagnostics Handset
Figure 17. SD665 V3 External Diagnostics Handset

Ordering information for the External Diagnostics Handset with is listed in the following table.

Table 31. External Diagnostics Handset ordering information
Part number Feature code Description
4TA7A64874 1410 BEUX ThinkSystem External Diagnostics Handset

System status with XClarity Mobile

The XClarity Mobile app includes a tethering function where you can connect your Android or iOS device to the server via USB to see the status of the server.

The steps to connect the mobile device are as follows:

  1. Enable USB Management on the server, by holding down the ID button for 3 seconds (or pressing the dedicated USB management button if one is present)
  2. Connect the mobile device via a USB cable to the server's USB port with the management symbol USB Management symbol
  3. In iOS or Android settings, enable Personal Hotspot or USB Tethering
  4. Launch the Lenovo XClarity Mobile app

Once connected you can see the following information:

  • Server status including error logs (read only, no login required)
  • Server management functions (XClarity login credentials required)

Remote management

The 1Gb onboard port and one of the 25Gb onboard ports (port 1) on the front of the SD665 V3 offer a connection to the XCC for remote management. This shared-NIC functionality allows the ports to be used both for operating system networking and for remote management.

Remote server management is provided through industry-standard interfaces:

  • Intelligent Platform Management Interface (IPMI) Version 2.0
  • Simple Network Management Protocol (SNMP) Version 3 (no SET commands; no SNMP v1)
  • Common Information Model (CIM-XML)
  • Representational State Transfer (REST) support
  • Redfish support (DMTF compliant)
  • Web browser - HTML 5-based browser interface (Java and ActiveX not required) using a responsive design (content optimized for device being used - laptop, tablet, phone) with NLS support

The 1Gb port and 25Gb Port 1 support NC-SI. You can enable NC-SI in the factory using the feature codes listed in the following table. If neither feature code is selected, both ports will have NC-SI disabled.

Table 32. Enabling NC-SI on the embedded network ports
Feature code Description
BEXY ThinkSystem NC-SI enabled on SFP28 Port (Port 1)
BEXZ ThinkSystem NC-SI enabled on RJ45 Port

IPMI via the Ethernet port (IPMI over LAN) is supported, however it is disabled by default. For CTO orders you can specify whether you want to the feature enabled or disabled in the factory, using the feature codes listed in the following table.

Table 33. IPMI-over-LAN settings
Feature code Description
B7XZ Disable IPMI-over-LAN (default)
B7Y0 Enable IPMI-over-LAN

XCC Platinum

The XCC2 service processor in the SD665 V3 supports an upgrade to a Platinum level of features. Compared to the XCC functions of ThinkSystem V2 and earlier systems, Platinum adds the same features as Enterprise and Advanced levels in ThinkSystem V2, plus additional features.

XCC Platinum adds the following Enterprise and Advanced functions:

  • Remotely viewing video with graphics resolutions up to 1600x1200 at 75 Hz with up to 23 bits per pixel, regardless of the system state
  • Remotely accessing the server using the keyboard and mouse from a remote client
  • International keyboard mapping support
  • Syslog alerting
  • Redirecting serial console via SSH
  • Component replacement log (Maintenance History log)
  • Access restriction (IP address blocking)
  • Lenovo SED security key management
  • Displaying graphics for real-time and historical power usage data and temperature
  • Boot video capture and crash video capture
  • Virtual console collaboration - Ability for up to 6 remote users to be log into the remote session simultaneously
  • Remote console Java client
  • Mapping the ISO and image files located on the local client as virtual drives for use by the server
  • Mounting the remote ISO and image files via HTTPS, SFTP, CIFS, and NFS
  • Power capping
  • System utilization data and graphic view
  • Single sign on with Lenovo XClarity Administrator
  • Update firmware from a repository
  • License for XClarity Energy Manager

XCC Platinum also adds the following features that are new to XCC2:

  • System Guard - Monitor hardware inventory for unexpected component changes, and simply log the event or prevent booting
  • Enterprise Strict Security mode - Enforces FIPS 140-3 level security and enhanced NIST 800-193 support
  • Neighbor Group - Enables administrators to manage and synchronize configurations and firmware level across multiple servers
  • Mini-Log - New service tool that provides XCC first-failure logs in HTML and JSON format

Ordering information is listed in the following table. XCC Platinum is a software license upgrade - no additional hardware is required.

Table 34. XCC Platinum license upgrade
Part number Feature code Description
7S0X000DWW BRPJ Lenovo XClarity XCC2 Platinum Upgrade

Remote management using the SMM

The DW612S enclosure includes a System Management Module 2 (SMM), installed in the rear of the enclosure. See Enclosure rear view for the location of the SMM. The SMM provides remote management of both the enclosure and the individual servers installed in the enclosure. The SMM can be accessed through a web browser interface and via Intelligent Platform Management Interface (IPMI) 2.0 commands.

The SMM provides the following functions:

  • Remote connectivity to XCC controllers in each node in the enclosure
  • Node-level reporting and control (for example, node virtual reseat/reset)
  • Enclosure power management
  • Enclosure thermal management
  • Enclosure inventory

The following figure shows the LEDs and connectors of the SMM.

System management module in the DW612S enclosure
Figure 18. System management module in the DW612S enclosure

The SMM has the following ports and LEDs:

  • 2x Gigabit Ethernet RJ45 ports for remote management access
  • USB port and activation button for service
  • SMM reset button
  • System error LED (yellow)
  • Identification (ID) LED (blue)
  • Status LED (green)
  • System power LED (green)

The USB service button and USB service port are used to gather service data in the event of an error. Pressing the service button copies First Failure Data Collection (FFDC) data to a USB key installed in the USB service port. The reset button is used to perform an SMM reset (short press) or to restore the SMM back to factory defaults (press for 4+ seconds).

The use of two RJ45 Ethernet ports enables the ability to daisy-chain the Ethernet management connections thereby reducing the number of ports you need in your management switches and reducing the overall cable density needed for systems management. With this feature you can connect the first SMM to your management network and the SMM in a second enclosure connects to the first SMM. The SMM in the third enclosure can then connect to the SMM in the second enclosure.

Up to 7 enclosures can be connected in a daisy-chain configuration and all servers in those enclosures can be managed remotely via one single Ethernet connection.

Notes:

  • If you are using IEEE 802.1D spanning tree protocol (STP) then at most 6 enclosures can be connected together
  • Do not form a loop with the network cabling. The dual-port SMM at the end of the chain should not be connected back to the switch that is connected to the top of the SMM chain.

Lenovo HPC & AI Software Stack

The Lenovo HPC & AI Software Stack combines open-source with proprietary best-of-breed Supercomputing software to provide the most consumable open-source HPC software stack embraced by all Lenovo HPC customers.

It provides a fully tested and supported, complete but customizable HPC software stack to enable the administrators and users in optimally and environmentally sustainable utilizing their Lenovo Supercomputers.

The Lenovo HPC & AI Software Stack is built on the most widely adopted and maintained HPC community software for orchestration and management. It integrates third party components especially around programming environments and performance optimization to complement and enhance the capabilities, creating the organic umbrella in software and service to add value for our customers.

The key open-source components of the software stack are as follows:

  • Confluent Management

    Confluent is Lenovo-developed open-source software designed to discover, provision, and manage HPC clusters and the nodes that comprise them. Confluent provides powerful tooling to deploy and update software and firmware to multiple nodes simultaneously, with simple and readable modern software syntax.

  • SLURM Orchestration

    Slurm is integrated as an open source, flexible, and modern choice to manage complex workloads for faster processing and optimal utilization of the large-scale and specialized high-performance and AI resource capabilities needed per workload provided by Lenovo systems. Lenovo provides support in partnership with SchedMD.

  • LiCO Webportal

    Lenovo Intelligent Computing Orchestration (LiCO) is a Lenovo-developed consolidated Graphical User Interface (GUI) for monitoring, managing and using cluster resources. The webportal provides workflows for both AI and HPC, and supports multiple AI frameworks, including TensorFlow, Caffe, Neon, and MXNet, allowing you to leverage a single cluster for diverse workload requirements.

  • Energy Aware Runtime

    EAR is a powerful European open-source energy management suite supporting anything from monitoring over power capping to live-optimization during the application runtime. Lenovo is collaborating with Barcelona Supercomputing Centre (BSC) and EAS4DC on the continuous development and support and offers three versions with differentiating capabilities.

For more information and ordering information, see the Lenovo HPC & AI Software Stack product guide:
https://lenovopress.com/lp1651

Lenovo XClarity Provisioning Manager

Lenovo XClarity Provisioning Manager (LXPM) is a UEFI-based application embedded in ThinkSystem servers and accessible via the F1 key during system boot.

LXPM provides the following functions:

  • Graphical UEFI Setup
  • System inventory information and VPD update
  • System firmware updates (UEFI and XCC)
  • RAID setup wizard
  • OS installation wizard (including unattended OS installation)
  • Diagnostics functions

Lenovo XClarity Essentials

Lenovo offers the following XClarity Essentials software tools that can help you set up, use, and maintain the server at no additional cost:

  • Lenovo Essentials OneCLI

    OneCLI is a collection of server management tools that uses a command line interface program to manage firmware, hardware, and operating systems. It provides functions to collect full system health information (including health status), configure system settings, and update system firmware and drivers.

  • Lenovo Essentials UpdateXpress

    The UpdateXpress tool is a standalone GUI application for firmware and device driver updates that enables you to maintain your server firmware and device drivers up-to-date and help you avoid unnecessary server outages. The tool acquires and deploys individual updates and UpdateXpress System Packs (UXSPs) which are integration-tested bundles.

  • Lenovo Essentials Bootable Media Creator

    The Bootable Media Creator (BOMC) tool is used to create bootable media for offline firmware update.

For more information and downloads, visit the Lenovo XClarity Essentials web page:
http://support.lenovo.com/us/en/documents/LNVO-center

Lenovo XClarity Administrator

Lenovo XClarity Administrator is a centralized resource management solution designed to reduce complexity, speed response, and enhance the availability of Lenovo systems and solutions. It provides agent-free hardware management for ThinkSystem servers, in addition to ThinkServer, System x, and Flex System servers. The administration dashboard is based on HTML 5 and allows fast location of resources so tasks can be run quickly.

Because Lenovo XClarity Administrator does not require any agent software to be installed on the managed endpoints, there are no CPU cycles spent on agent execution, and no memory is used, which means that up to 1GB of RAM and 1 - 2% CPU usage is saved, compared to a typical managed system where an agent is required.

Lenovo XClarity Administrator is an optional software component for the SD665 V3. The software can be downloaded and used at no charge to discover and monitor the SD665 V3 and to manage firmware upgrades.

If software support is required for Lenovo XClarity Administrator, or premium features such as configuration management and operating system deployment are required, Lenovo XClarity Pro software subscription should be ordered. Lenovo XClarity Pro is licensed on a per managed system basis, that is, each managed Lenovo system requires a license.

The following table lists the geo-specific Lenovo XClarity software license options.

Table 35. Lenovo XClarity software options
Part number
(NA, AP, Japan markets)
Part number
(EMEA, LA markets)
Description
00MT201 00MT207 Lenovo XClarity Pro, per Managed Endpoint w/1 Yr SW S&S
00MT202 00MT208 Lenovo XClarity Pro, per Managed Endpoint w/3 Yr SW S&S
00MT203 00MT209 Lenovo XClarity Pro, per Managed Endpoint w/5 Yr SW S&S

Lenovo XClarity Administrator offers the following standard features that are available at no charge:

  • Auto-discovery and monitoring of Lenovo systems
  • Firmware updates and compliance enforcement
  • External alerts and notifications via SNMP traps, syslog remote logging, and e-mail
  • Secure connections to managed endpoints
  • NIST 800-131A or FIPS 140-2 compliant cryptographic standards between the management solution and managed endpoints
  • Integration into existing higher-level management systems such as cloud automation and orchestration tools through REST APIs, providing extensive external visibility and control over hardware resources
  • An intuitive, easy-to-use GUI
  • Scripting with Windows PowerShell, providing command-line visibility and control over hardware resources

Lenovo XClarity Administrator offers the following premium features that require an optional Pro license:

  • Pattern-based configuration management that allows to define configurations once and apply repeatedly without errors when deploying new servers or redeploying existing servers without disrupting the fabric
  • Bare-metal deployment of operating systems and hypervisors to streamline infrastructure provisioning

For more information, refer to the Lenovo XClarity Administrator Product Guide:
http://lenovopress.com/tips1200

Lenovo XClarity Integrators

Lenovo also offers software plug-in modules, Lenovo XClarity Integrators, to manage physical infrastructure from leading external virtualization management software tools including those from Microsoft and VMware.

These integrators are offered at no charge, however if software support is required, a Lenovo XClarity Pro software subscription license should be ordered.

Lenovo XClarity Integrators offer the following additional features:

  • Ability to discover, manage, and monitor Lenovo server hardware from VMware vCenter or Microsoft System Center
  • Deployment of firmware updates and configuration patterns to Lenovo x86 rack servers and Flex System from the virtualization management tool
  • Non-disruptive server maintenance in clustered environments that reduces workload downtime by dynamically migrating workloads from affected hosts during rolling server updates or reboots
  • Greater service level uptime and assurance in clustered environments during unplanned hardware events by dynamically triggering workload migration from impacted hosts when impending hardware failures are predicted

For more information about all the available Lenovo XClarity Integrators, see the Lenovo XClarity Administrator Product Guide: https://lenovopress.com/tips1200-lenovo-xclarity-administrator

Lenovo XClarity Energy Manager

Lenovo XClarity Energy Manager (LXEM) is a power and temperature management solution for data centers. It is an agent-free, web-based console that enables you to monitor and manage power consumption and temperature in your data center through the management console. It enables server density and data center capacity to be increased through the use of power capping.

LXEM is a licensed product. A single-node LXEM license is included with the XClarity Controller Platinum upgrade as described in the Remote Management section. If your server does not have the XCC Platinum upgrade, Energy Manager licenses can be ordered as shown in the following table.

Table 36. Lenovo XClarity Energy Manager
Part number Description
4L40E51621 Lenovo XClarity Energy Manager Node License (1 license needed per server)

Note: The SD665 V3 does not support the following Energy Manager functions:

  • Power capping
  • Policy-based management

For more information about XClarity Energy Manager, see the following resources:

Lenovo Capacity Planner

Lenovo Capacity Planner is a power consumption evaluation tool that enhances data center planning by enabling IT administrators and pre-sales professionals to understand various power characteristics of racks, servers, and other devices. Capacity Planner can dynamically calculate the power consumption, current, British Thermal Unit (BTU), and volt-ampere (VA) rating at the rack level, improving the planning efficiency for large scale deployments.

For more information, refer to the Capacity Planner web page:
http://datacentersupport.lenovo.com/us/en/solutions/lnvo-lcp

Security

Topics in this section:

Security features

The server offers the following electronic security features:

  • Administrator and power-on password
  • Trusted Platform Module (TPM) supporting TPM 2.0 (no support for TPM 1.2)
  • Planned support for an optional Nationz TPM 2.0, available only in China (CTO only)

The server is NIST SP 800-147B compliant.

Platform Firmware Resiliency - Lenovo ThinkShield

Lenovo’s ThinkShield Security is a transparent and comprehensive approach to security that extends to all dimensions of our data center products: from development, to supply chain, and through the entire product lifecycle.

The ThinkSystem SD665 V3 includes Platform Firmware Resiliency (PFR) hardware Root of Trust (RoT) which enables the system to be NIST SP800-193 compliant. This offering further enhances key platform subsystem protections against unauthorized firmware updates and corruption, to restore firmware to an integral state, and to closely monitor firmware for possible compromise from cyber attacks.

PFR operates upon the following server components:

  • UEFI image – the low-level server firmware that connects the operating system to the server hardware
  • XCC image – the management “engine” software that controls and reports on the server status separate from the server operating system
  • FPGA image – the code that runs the server’s lowest level hardware controller on the motherboard

The Lenovo Platform Root of Trust Hardware performs the following three main functions:

  • Detection – Measures the firmware and updates for authenticity
  • Recovery – Recovers a corrupted image to a known-safe image
  • Protection – Monitors the system to ensure the known-good firmware is not maliciously written

These enhanced protection capabilities are implemented using a dedicated, discrete security processor whose implementation has been rigorously validated by leading third-party security firms. Security evaluation results and design details are available for customer review – providing unprecedented transparency and assurance.

The SD665 V3 includes support for Secure Boot, a UEFI firmware security feature developed by the UEFI Consortium that ensures only immutable and signed software are loaded during the boot time. The use of Secure Boot helps prevent malicious code from being loaded and helps prevent attacks, such as the installation of rootkits. Lenovo offers the capability to enable secure boot in the factory, to ensure end-to-end protection. Alternatively, Secure Boot can be left disabled in the factory, allowing the customer to enable it themselves at a later point, if desired.

The following table lists the feature code to enable secure boot in the factory, or to leave it disabled.

Table 37. Secure Boot options
Part number Feature code Description Purpose
CTO only AUK7 TPM 2.0 and Secure Boot Configure the system in the factory with Secure Boot enabled.
CTO only B0MK Enable TPM 2.0 Configure the system without Secure Boot enabled. Customers can enable Secure Boot later if desired.

Tip: If Secure Boot is not enabled in the factory, it can be enabled later by the customer. However once Secure Boot is enabled, it cannot be disabled.

Security standards

The SD665 V3 supports the following security standards and capabilities:

  • Industry Standard Security Capabilities
    • AMD CPU Enablement
      • AES-NI (Advanced Encryption Standard New Instructions)
      • GMET (Guest Mode Execute Trap)
      • Hardware-based side channel attack resilience enhancements
      • NX (No eXecute)
      • PSB (Platform Secure Boot)
      • Shadow Stack
      • SEV (Secure Encrypted Virtualization)
      • SEV-ES (Encrypted State register encryption)
      • SEV-SNP (Secure Nested Paging)
      • SVM (Secure Virtual Machine)
      • SME (Secure Memory Encryption)
      • UMIP (User Mode Instruction Prevention)
    • Microsoft Windows Security Enablement
      • Credential Guard
      • Device Guard
      • Host Guardian Service
    • TCG (Trusted Computing Group) TPM (Trusted Platform Module) 2.0
    • UEFI (Unified Extensible Firmware Interface) Forum Secure Boot
  • Hardware Root of Trust and Security
    • Independent security subsystem providing platform-wide NIST SP800-193 compliant Platform Firmware Resilience (PFR)
    • Host domain RoT supplemented by AMD Platform Secure Boot (PSB)
    • Management domain RoT supplemented by the Secure Boot features of XCC
  • Platform Security

    For more information on platform security, see the paper “How to Harden the Security of your ThinkSystem Server and Management Applications” available from https://lenovopress.com/lp1260-how-to-harden-the-security-of-your-thinksystem-server.

    • Boot and run-time firmware integrity monitoring with rollback to known-good firmware (e.g., “self-healing”)
    • Non-volatile storage bus security monitoring and filtering
    • Resilient firmware implementation, such as to detect and defeat unauthorized flash writes or SMM (System Management Mode) memory incursions
    • Patented IPMI KCS channel privileged access authorization (USPTO Patent# 11,256,810)
    • Host and management domain authorization, including integration with CyberArk for enterprise password management
    • KMIP (Key Management Interoperability Protocol) compliant, including support for IBM SKLM and Thales KeySecure
    • Reduced “out of box” attack surface
    • Configurable network services
    • FIPS 140-3 (in process) validated cryptography for XCC
    • CNSA Suite 1.0 Quantum-resistant cryptography for XCC
    • Lenovo System Guard
  • Standards Compliance and/or Support
    • NIST SP800-131A rev 2 “Transitioning the Use of Cryptographic Algorithms and Key Lengths”
    • NIST SP800-147B “BIOS Protection Guidelines for Servers”
    • NIST SP800-193 “Platform Firmware Resiliency Guidelines”
    • ISO/IEC 11889 “Trusted Platform Module Library”
    • Common Criteria TCG Protection Profile for “PC Client Specific TPM 2.0”
    • European Union Commission Regulation 2019/424 (“ErP Lot 9”) “Ecodesign Requirements for Servers and Data Storage Products” Secure Data Deletion
    • Optional FIPS 140-2 validated Self-Encrypting Disks (SEDs) with external KMIP-based key management
  • Product and Supply Chain Security
    • Suppliers validated through Lenovo’s Trusted Supplier Program
    • Developed in accordance with Lenovo’s Secure Development Lifecycle (LSDL)
    • Continuous firmware security validation through automated testing, including static code analysis, dynamic network and web vulnerability testing, software composition analysis, and subsystem-specific testing, such as UEFI security configuration validation
    • Ongoing security reviews by US-based security experts, with attestation letters available from our third-party security partners
    • Digitally signed firmware, stored and built on US-based infrastructure and signed on US-based Hardware Security Modules (HSMs)
    • Manufacturing transparency via Intel Transparent Supply Chain (for details, see https://lenovopress.com/lp1434-introduction-to-intel-transparent-supply-chain-on-lenovo-thinksystem-servers)
    • TAA (Trade Agreements Act) compliant manufacturing, by default in Mexico for North American markets with additional US and EU manufacturing options
    • US 2019 NDAA (National Defense Authorization Act) Section 889 compliant

Operating system support

The server supports the following operating systems:

  • Red Hat Enterprise Linux 8.6
  • Red Hat Enterprise Linux 9.0
  • SUSE Linux Enterprise Server 15 SP4
  • SUSE Linux Enterprise Server 15 Xen SP4
  • Ubuntu 20.04 LTS 64-bit
  • Ubuntu 22.04 LTS 64-bit

The server is also certified or tested with the following operating systems:

  • Ubuntu
  • Rocky Linux
  • AlmaLinux

See Operating System Interoperability Guide (OSIG) for the complete list of supported, certified, and tested operating systems, including version and point releases: https://lenovopress.lenovo.com/osig#servers=sd665-v3-7d9p&support=all

Also review the latest LeSI Best Recipe to see the operating systems that are supported via Lenovo Scalable Infrastructure (LeSI):
https://support.lenovo.com/us/en/solutions/HT505184#5
 

Physical and electrical specifications

Six SD665 V3 server trays are installed in the DW612S enclosure. Each SD665 V3 tray has the following dimensions:

  • Width: 438 mm (17.2 inches)
  • Height: 41 mm (1.6 inches)
  • Depth: 714 mm (28.1 inches) (769 mm, including the water connections at the rear of the server)

The DW612S enclosure has the following overall physical dimensions, excluding components that extend outside the standard chassis, such as EIA flanges, front security bezel (if any), and power supply handles:

  • Width: 447 mm (17.6 inches)
  • Height: 264 mm (10.4 inches)
  • Depth: 933 mm (36.7 inches)

The following table lists the detailed dimensions. See the figure below for the definition of each dimension.

Table 38. Detailed dimensions
Dimension Description
483 mm Xa = Width, to the outsides of the front EIA flanges
447 mm Xb = Width, to the rack rail mating surfaces
447 mm Xc = Width, to the outer most chassis body feature
264 mm Ya = Height, from the bottom of chassis to the top of the chassis
916 mm Za = Depth, from the rack flange mating surface to the rearmost I/O port surface
916 mm Zb = Depth, from the rack flange mating surface to the rearmost feature of the chassis body
972 mm Zc = Depth, from the rack flange mating surface to the rearmost feature such as power supply handle
17 mm Zd = Depth, from the forwardmost feature on front of EIA flange to the rack flange mating surface
17 mm Ze = Depth, from the front of security bezel (if applicable) or forwardmost feature to the rack flange mating surface

Enclosure dimensions
Figure 19. Enclosure dimensions

The SD665 V3 tray has the following maximum weight:

  • 23.6 kg (52.0 lb)

The DW612S enclosure has the following weight:

  • Empty enclosure (with midplane and cables): 24.3 kg (53.5 lb)
  • Fully configured enclosure:
    • With 9x air-cooled power supplies and 6x SD665 V3 server trays (12 nodes): 182.9 kg (403 lb) (without water manifold)
    • with 3x water-cooled power supplies and 6x SD665 V3 server trays (12 nodes): 188.7 kg (416 lb) (without water manifold)

The enclosure has the following electrical specifications for AC input power supplies:

  • Input voltage:
    • 200 to 240 (nominal) Vac, 50 Hz or 60 Hz
    • 180 to 300 Vdc (China only)
  • Max current for 2600W power supplies:
    • 200-208V AC: 13.2A
    • 220-240V AC: 13A
    • 240V DC: 11.9A (China only)
  • Max current for 7200W power supplies (each of 3 inputs):
    • 200-208V AC: 12.7A
    • 220-240V AC: 12A
    • 240V DC: 11A (China only)

Operating environment

The SD665 V3 server trays and DW612S enclosure are supported in the following environment:

Water requirements

  • Water Temperature: ASHRAE W45: up to 45°C (113°F) at the manifold
    • CPUs up to 400W TDP
    • DIMMs up to 64GB capacity
    • NVIDIA HDR/NDR cards up to 200Gb/sec
  • Water Temperature: ASHRAE W32: up to 32°C (89.6°F), 
    • 128GB DIMMs
  • Maximum pressure: 3.5 bar per rack
  • Water flow rate:
    • Typical - ASHRAE W45: 12 liters per minute (lpm) per enclosure (2.0 lpm per compute tray with 6 trays per enclosure)
    • Minimum - ASHRAE W32: 9 lpm per enclosure (1.5 lpm per compute tray with 6 trays per enclosure)

Note: The water required to initially fill the system side cooling loop must be reasonably clean, bacteria- free water (<100 CFU/ml) such as de-mineralized water, reverse osmosis water, de-ionized water, or distilled water. The water must be filtered with an in-line 50 micron filter (approximately 288 mesh). The water must be treated with anti-biological and anti-corrosion measures.

Air temperature requirements

  • Operating: ASHRAE A2: 10°C to 35°C (50°F to 95°F); when the altitude exceeds 900 m (2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F) with every 300 m (984 ft) of altitude increase.
  • Powered off: 5°C to 45°C (41°F to 113°F)
  • Shipping/storage: -40°C to 60°C (-40°F to 140°F)

Relative humidity (non-condensing)

  • Operating: ASHRAE Class A2: 8% - 80%, maximum dew point : 21°C (70°F)
  • Shipment/storage: 8% - 90%

Particulate contamination

Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might damage the system that might cause the system to malfunction or stop working altogether.

The following specifications indicate the limits of particulates that the system can tolerate:

  • Reactive gases:
    • The reactivity rate of copper coupons shall be less than 200 Angstroms per month (Å/month)
    • The reactivity rate of silver coupons shall be less than 200 Å/month
  • Airborne particulates:
    • The room air should be continuously filtered with MERV 8 filters.
    • Air entering a data center should be filtered with MERV 11 or preferably MERV 13 filters.
    • The deliquescent relative humidity of the particulate contamination should be more than 60% RH
    • Data centers must be free of zinc whiskers

For additional information, see the Specifications section of the Setup Guide for the server, available from the Lenovo ThinkSystem Information Center, https://thinksystem.lenovofiles.com/help/index.jsp

Regulatory compliance

The SD665 V3 conforms to the following standards:

  • ANSI/UL 62368-1
  • IEC 62368-1 (CB Certificate and CB Test Report)
  • FCC - Verified to comply with Part 15 of the FCC Rules, Class A
  • Canada ICES-003, issue 7, Class A
  • CSA C22.2 No. 62368-1
  • CISPR 32, Class A, CISPR 35
  • Japan VCCI, Class A
  • Taiwan BSMI CNS13438, Class A; Section 5 of CNS15663
  • CE, UKCA Mark (EN55032 Class A, EN62368-1, EN55035, EN61000-3-11, EN61000-3-12, (EU) 2019/424, and EN50581-1 (RoHS))
  • Korea KN32, Class A, KN35
  • Russia, Belorussia and Kazakhstan, TP EAC 037/2016 (for RoHS)
  • Australia/New Zealand AS/NZS CISPR 32, Class A; AS/NZS 62368.1
  • SGS, VOC Emission
  • Energy Star 3.0
  • EPEAT (NSF/ ANSI 426) Bronze
  • China CELP certificate, HJ 2507-2011
  • Japanese Energy-Saving Act
  • Ukraine UkrCEPRO
  • Morocco CMIM Certification (CM)
  • EU2019/424 Energy Related Product (ErP Lot9)

The DW612S conforms to the following standards:

  • ANSI/UL 62368-1
  • IEC 62368-1 (CB Certificate and CB Test Report)
  • FCC - Verified to comply with Part 15 of the FCC Rules, Class A
  • Canada ICES-003, issue 7, Class A
  • CSA C22.2 No. 62368-1
  • CISPR 32, Class A, CISPR 35
  • Japan VCCI, Class A
  • CE, UKCA Mark (EN55032 Class A, EN62368-1, EN55035, EN61000-3-11, EN61000-3-12, (EU) 2019/424, and EN50581-1 (RoHS))
  • Korea KN32, Class A, KN35
  • Russia, Belorussia and Kazakhstan, TP EAC 037/2016 (for RoHS)
  • Russia, Belorussia and Kazakhstan, EAC: TP TC 004/2011 (for Safety); TP TC 020/2011 (for EMC)
  • Australia/New Zealand AS/NZS CISPR 32, Class A; AS/NZS 62368.1
  • SGS, VOC Emission
  • China CELP certificate, HJ 2507-2011
  • Mexico NOM-019
  • Ukraine UkrCEPRO
  • Morocco CMIM Certification (CM)

Warranty and Support

The server and enclosure have the following warranty:

  • Lenovo ThinkSystem SD665 V3 (7D9P) - 3-year warranty
  • Lenovo ThinkSystem DW612S Enclosure (7D1L) - 3-year warranty
  • Lenovo Neptune DWC Node Manifold (5469) - 3-year warranty
  • Lenovo Neptune DWC RM100 In-Rack CDU (7DBL) - 1-year warranty through the vendor (Cooltera)
  • Genie Lift GL-8 Material Lift (7D5Y) - 3-year warranty though the vendor (Genie)

The standard warranty terms are customer-replaceable unit (CRU) and onsite (for field-replaceable units FRUs only) with standard call center support during normal business hours and 9x5 Next Business Day Parts Delivered.

Lenovo’s additional support services provide a sophisticated, unified support structure for your data center, with an experience consistently ranked number one in customer satisfaction worldwide. Available offerings include:

  • Premier Support

    Premier Support provides a Lenovo-owned customer experience and delivers direct access to technicians skilled in hardware, software, and advanced troubleshooting, in addition to the following:

    • Direct technician-to-technician access through a dedicated phone line
    • 24x7x365 remote support
    • Single point of contact service
    • End to end case management
    • Third-party collaborative software support
    • Online case tools and live chat support
    • On-demand remote system analysis
  • Warranty Upgrade (Preconfigured Support)

    Services are available to meet the on-site response time targets that match the criticality of your systems.

    • 3, 4, or 5 years of service coverage
    • 1-year or 2-year post-warranty extensions
    • Foundation Service: 9x5 service coverage with next business day onsite response. YourDrive YourData is an optional extra (see below).
    • Essential Service: 24x7 service coverage with 4-hour onsite response or 24-hour committed repair (available only in select markets). Bundled with YourDrive YourData.
    • Advanced Service: 24x7 service coverage with 2-hour onsite response or 6-hour committed repair (available only in select markets). Bundled with YourDrive YourData.
  • Managed Services

    Lenovo Managed Services provides continuous 24x7 remote monitoring (plus 24x7 call center availability) and proactive management of your data center using state-of-the-art tools, systems, and practices by a team of highly skilled and experienced Lenovo services professionals.

    Quarterly reviews check error logs, verify firmware & OS device driver levels, and software as needed. We’ll also maintain records of latest patches, critical updates, and firmware levels, to ensure you systems are providing business value through optimized performance.

  • Technical Account Management (TAM)

    A Lenovo Technical Account Manager helps you optimize the operation of your data center based on a deep understanding of your business. You gain direct access to your Lenovo TAM, who serves as your single point of contact to expedite service requests, provide status updates, and furnish reports to track incidents over time. In addition, your TAM will help proactively make service recommendations and manage your service relationship with Lenovo to make certain your needs are met.

  • Enterprise Server Software Support

    Enterprise Software Support is an additional support service providing customers with software support on Microsoft, Red Hat, SUSE, and VMware applications and systems. Around the clock availability for critical problems plus unlimited calls and incidents helps customers address challenges fast, without incremental costs. Support staff can answer troubleshooting and diagnostic questions, address product comparability and interoperability issues, isolate causes of problems, report defects to software vendors, and more.

  • YourDrive YourData

    Lenovo’s YourDrive YourData is a multi-drive retention offering that ensures your data is always under your control, regardless of the number of drives that are installed in your Lenovo server. In the unlikely event of a drive failure, you retain possession of your drive while Lenovo replaces the failed drive part. Your data stays safely on your premises, in your hands. The YourDrive YourData service can be purchased in convenient bundles and is optional with Foundation Service. It is bundled with Essential Service and Advanced Service.

  • Health Check

    Having a trusted partner who can perform regular and detailed health checks is central to maintaining efficiency and ensuring that your systems and business are always running at their best. Health Check supports Lenovo-branded server, storage, and networking devices, as well as select Lenovo-supported products from other vendors that are sold by Lenovo or a Lenovo-Authorized Reseller.

Examples of region-specific warranty terms are second or longer business day parts delivery or parts-only base warranty.

If warranty terms and conditions include onsite labor for repair or replacement of parts, Lenovo will dispatch a service technician to the customer site to perform the replacement. Onsite labor under base warranty is limited to labor for replacement of parts that have been determined to be field-replaceable units (FRUs). Parts that are determined to be customer-replaceable units (CRUs) do not include onsite labor under base warranty.

If warranty terms include parts-only base warranty, Lenovo is responsible for delivering only replacement parts that are under base warranty (including FRUs) that will be sent to a requested location for self-service. Parts-only service does not include a service technician being dispatched onsite. Parts must be changed at customer’s own cost and labor and defective parts must be returned following the instructions supplied with the spare parts.

Lenovo Service offerings are region-specific. Not all preconfigured support and upgrade options are available in every region. For information about Lenovo service upgrade offerings that are available in your region, refer to the following resources:

For service definitions, region-specific details, and service limitations, please refer to the following documents:

Services

Lenovo Services is a dedicated partner to your success. Our goal is to reduce your capital outlays, mitigate your IT risks, and accelerate your time to productivity.

Note: Some service options may not be available in all markets or regions. For more information, go to https://www.lenovo.com/services. For information about Lenovo service upgrade offerings that are available in your region, contact your local Lenovo sales representative or business partner.

Here’s a more in-depth look at what we can do for you:

  • Asset Recovery Services

    Asset Recovery Services (ARS) helps customers recover the maximum value from their end-of-life equipment in a cost-effective and secure way. On top of simplifying the transition from old to new equipment, ARS mitigates environmental and data security risks associated with data center equipment disposal. Lenovo ARS is a cash-back solution for equipment based on its remaining market value, yielding maximum value from aging assets and lowering total cost of ownership for your customers. For more information, see the ARS page, https://lenovopress.com/lp1266-reduce-e-waste-and-grow-your-bottom-line-with-lenovo-ars.

  • Assessment Services

    An Assessment helps solve your IT challenges through an onsite, multi-day session with a Lenovo technology expert. We perform a tools-based assessment which provides a comprehensive and thorough review of a company's environment and technology systems. In addition to the technology based functional requirements, the consultant also discusses and records the non-functional business requirements, challenges, and constraints. Assessments help organizations like yours, no matter how large or small, get a better return on your IT investment and overcome challenges in the ever-changing technology landscape.

  • Design Services

    Professional Services consultants perform infrastructure design and implementation planning to support your strategy. The high-level architectures provided by the assessment service are turned into low level designs and wiring diagrams, which are reviewed and approved prior to implementation. The implementation plan will demonstrate an outcome-based proposal to provide business capabilities through infrastructure with a risk-mitigated project plan.

  • Basic Hardware Installation

    Lenovo experts can seamlessly manage the physical installation of your server, storage, or networking hardware. Working at a time convenient for you (business hours or off shift), the technician will unpack and inspect the systems on your site, install options, mount in a rack cabinet, connect to power and network, check and update firmware to the latest levels, verify operation, and dispose of the packaging, allowing your team to focus on other priorities.

  • Deployment Services

    When investing in new IT infrastructures, you need to ensure your business will see quick time to value with little to no disruption. Lenovo deployments are designed by development and engineering teams who know our Products & Solutions better than anyone else, and our technicians own the process from delivery to completion. Lenovo will conduct remote preparation and planning, configure & integrate systems, validate systems, verify and update appliance firmware, train on administrative tasks, and provide post-deployment documentation. Customer’s IT teams leverage our skills to enable IT staff to transform with higher level roles and tasks.

  • Integration, Migration, and Expansion Services

    Move existing physical & virtual workloads easily, or determine technical requirements to support increased workloads while maximizing performance. Includes tuning, validation, and documenting ongoing run processes. Leverage migration assessment planning documents to perform necessary migrations.

  • Data Center Power and Cooling Services

    The Data Center Infrastructure team will provide solution design and implementation services to support the power and cooling needs of the multi-node chassis and multi-rack solutions. This includes designing for various levels of power redundancy and integration into the customer power infrastructure. The Infrastructure team will work with site engineers to design an effective cooling strategy based on facility constraints or customer goals and optimize a cooling solution to ensure high efficiency and availability. The Infrastructure team will provide the detailed solution design and complete integration of the cooling solution into the customer data center. In addition, the Infrastructure team will provide rack and chassis level commissioning and stand-up of the water-cooled solution which includes setting and tuning of the flow rates based on water temperature and heat recovery targets. Lastly, the Infrastructure team will provide cooling solution optimization and performance validation to ensure the highest overall operational efficiency of the solution.

Rack cabinets

The DW612S enclosure is supported in the following racks:

  • Lenovo EveryScale 42U Onyx Heavy Duty Rack Cabinet, model 1410-O42
  • Lenovo EveryScale 42U Pearl Heavy Duty Rack Cabinet, model 1410-P42
  • Lenovo EveryScale 48U Onyx Heavy Duty Rack Cabinet, model 1410-O48
  • Lenovo EveryScale 48U Pearl Heavy Duty Rack Cabinet, model 1410-P48

Considering the weight of the trays in the enclosure, an onsite material lift is required to allow service by a single person. If you do not already have a material lift available, Lenovo offers the Genie Lift GL-8 material lift as configurable option to the rack cabinets. Ordering information is listed in the following table.

Table 39. Genie Lift GL-8 ordering information
Model Description
7D5YCTO1WW Genie Lift GL-8 Material Lift

Lenovo Financial Services

Lenovo Financial Services reinforces Lenovo’s commitment to deliver pioneering products and services that are recognized for their quality, excellence, and trustworthiness. Lenovo Financial Services offers financing solutions and services that complement your technology solution anywhere in the world.

We are dedicated to delivering a positive finance experience for customers like you who want to maximize your purchase power by obtaining the technology you need today, protect against technology obsolescence, and preserve your capital for other uses.

We work with businesses, non-profit organizations, governments and educational institutions to finance their entire technology solution. We focus on making it easy to do business with us. Our highly experienced team of finance professionals operates in a work culture that emphasizes the importance of providing outstanding customer service. Our systems, processes and flexible policies support our goal of providing customers with a positive experience.

We finance your entire solution. Unlike others, we allow you to bundle everything you need from hardware and software to service contracts, installation costs, training fees, and sales tax. If you decide weeks or months later to add to your solution, we can consolidate everything into a single invoice.

Our Premier Client services provide large accounts with special handling services to ensure these complex transactions are serviced properly. As a premier client, you have a dedicated finance specialist who manages your account through its life, from first invoice through asset return or purchase. This specialist develops an in-depth understanding of your invoice and payment requirements. For you, this dedication provides a high-quality, easy, and positive financing experience.

For your region-specific offers, please ask your Lenovo sales representative or your technology provider about the use of Lenovo Financial Services. For more information, see the following Lenovo website:

https://www.lenovo.com/us/en/landingpage/lenovo-financial-services/

Related product families

Product families related to this document are the following:

Trademarks

Lenovo and the Lenovo logo are trademarks or registered trademarks of Lenovo in the United States, other countries, or both. A current list of Lenovo trademarks is available on the Web at https://www.lenovo.com/us/en/legal/copytrade/.

The following terms are trademarks of Lenovo in the United States, other countries, or both:
Lenovo®
Bootable Media Creator
Flex System
from Exascale to Everyscale
Lenovo Neptune®
Lenovo Services
ServerProven®
System x®
ThinkShield®
ThinkServer®
ThinkSystem®
UpdateXpress System Packs
XClarity®

The following terms are trademarks of other companies:

Intel® and Xeon® are trademarks of Intel Corporation or its subsidiaries.

Linux® is the trademark of Linus Torvalds in the U.S. and other countries.

ActiveX®, Microsoft®, PowerShell, Windows PowerShell®, and Windows® are trademarks of Microsoft Corporation in the United States, other countries, or both.

SPECpower® is a trademark of the Standard Performance Evaluation Corporation (SPEC).

Other company, product, or service names may be trademarks or service marks of others.