Author
Updated
29 Sep 2024Form Number
LP1600PDF size
161 pages, 5.4 MB- Introduction
- Did you know?
- Key features
- Comparing the SR630 V3 to the SR630 V2
- Components and connectors
- System architecture
- Standard specifications
- Models
- Processors
- Memory options
- Persistent memory
- Internal storage
- Controllers for internal storage
- Internal drive options
- Internal backup units
- Optical drives
- I/O expansion
- Network adapters
- Fibre Channel host bus adapters
- SAS adapters for external storage
- Flash storage adapters
- GPU adapters
- Cooling
- Power supplies
- Systems management
- Security
- Rack installation
- Operating system support
- Physical and electrical specifications
- Operating environment
- Water infrastructure for the Lenovo Neptune Processor DWC Module
- RM100 In-Rack Coolant Distribution Unit
- Warranty and Support
- Services
- Regulatory compliance
- External drive enclosures
- External storage systems
- External backup units
- Fibre Channel SAN switches
- Uninterruptible power supply units
- Power distribution units
- Rack cabinets
- KVM console options
- Lenovo Financial Services
- Seller training courses
- Related publications and links
- Related product families
- Trademarks
Abstract
The Lenovo ThinkSystem SR630 V3 is an ideal 2-socket 1U rack server for small businesses up to large enterprises that need industry-leading reliability, management, and security, as well as maximizing performance and flexibility for future growth. The SR630 V3 is designed to handle a wide range of workloads, such as databases, virtualization and cloud computing, virtual desktop infrastructure (VDI), infrastructure security, systems management, enterprise applications, collaboration/email, streaming media, web, and HPC.
This product guide provides essential pre-sales information to understand the ThinkSystem SR630 V3 server, its key features and specifications, components and options, and configuration guidelines. This guide is intended for technical specialists, sales specialists, sales engineers, IT architects, and other IT professionals who want to learn more about the SR630 V3 and consider its use in IT solutions.
Change History
Changes in the September 29, 2024 update:
- Added links to the documentation flyer for each backplane and cable kit option part number - Field upgrades section
Introduction
The Lenovo ThinkSystem SR630 V3 is an ideal 2-socket 1U rack server for small businesses up to large enterprises that need industry-leading reliability, management, and security, as well as maximizing performance and flexibility for future growth. The SR630 V3 is based on the new 5th generation Intel Xeon Scalable processor family (formerly codenamed "Emerald Rapids").
The SR630 V3 is designed to handle a wide range of workloads, such as databases, virtualization and cloud computing, infrastructure security, systems management, enterprise applications, collaboration/email, streaming media, web, and HPC.
Did you know?
The SR630 V3 server has been designed to take advantage of the features of the 5th generation Intel Xeon Scalable processors, such as the full performance of 385W 64-core processors, support for 5600 MHz memory and PCIe Gen 5.0 support. The server also offers onboard NVMe PCIe ports that allow direct connections to 16x NVMe SSDs, which results in faster access to store and access data.
Key features
Combining performance and flexibility, the SR630 V3 server is a great choice for enterprises of all sizes. The server offers a broad selection of drive and slot configurations and offers numerous high performance features. Outstanding reliability, availability, and serviceability (RAS) and high-efficiency design can improve your business environment and can help save operational costs.
Scalability and performance
The ThinkSystem SR630 V3 offers numerous features to boost performance, improve scalability and reduce costs:
- Supports one or two 5th Gen Intel Xeon Processor Scalable processors
- Up to 64 cores and 128 threads
- Core speeds of up to 3.9 GHz
- TDP ratings of up to 385 W
- Supports one or two 4th Gen Intel Xeon Processor Scalable processors
- Up to 60 cores and 120 threads
- Core speeds of up to 3.7 GHz
- TDP ratings of up to 350 W
- Support for DDR5 memory DIMMs to maximize the performance of the memory subsystem:
- Up to 32 DDR5 memory DIMMs, 16 DIMMs per processor
- 8 memory channels per processor (2 DIMMs per channel)
- Supports 1 DIMM per channel operating at 5600 MHz (5th Gen processors) or 4800 MHz (4th Gen processors)
- Supports 2 DIMMs per channel operating at 4800 MHz (5th Gen processors) or 4400 MHz (4th Gen processors)
- Using 256GB 3DS RDIMMs, the server supports up to 8TB of system memory
- Supports the new Intel Optane Persistent Memory 300 Series for advanced in-memory database applications, dense-virtualization; up to 16 PMem Modules can be installed in conjunction with regular system memory.
- Supports up to three single-width GPUs, each up to 75W for substantial processing power in a 1U system.
- Supports up to 12x 2.5-inch hot-swap drive bays, by using combinations of front-accessible (up to 10 bays) and rear-accessible (2 bays).
- Supports four 3.5-inch drive bays for lower-cost high-capacity HDD storage.
- Supports 16x EDSFF NVMe drives, a new form factor drive for high-density and high-performance storage.
- Supports up to 16x NVMe drives without oversubscription of PCIe lanes (1:1 connectivity) and without the need for additional NVMe adapters. The use of NVMe drives maximizes drive I/O performance, in terms of throughput and latency.
- Supports 12x SATA drives using the onboard SATA controller (no additional adapter needed), enabling lower cost, high capacity storage solution.
- Supports 12x SAS drives using a variety of 12Gb RAID controllers and SAS HBAs.
- Supports high-speed RAID controllers providing 12 Gb SAS connectivity to the drive backplanes. A variety of PCIe 3.0 and PCIe 4.0 RAID adapters are available.
- Supports up to two externally accessible 7mm hot-swap drives for operating system boot functions. Optional RAID with the use of Intel VROC.
- Supports M.2 drives for convenient operating system boot functions or data storage. Available M.2 adapters support either one M.2 drive or two M.2 drives. Optional RAID with the use of Intel VROC.
- Supports up to 5x PCIe slots, 3x at the rear of the server and 2x at the front of the server. Also supports 1x OCP 3.0 slot, either in the front or in the rear.
- The server is Compute Express Link (CXL) v1.1 Ready. With CXL 1.1 for next-generation workloads, you can reduce compute latency in the data center and lower TCO. CXL is a protocol that runs across the standard PCIe physical layer and can support both standard PCIe devices as well as CXL devices on the same link.
- The server has a dedicated industry-standard OCP 3.0 small form factor (SFF) slot supporting a variety of Ethernet network adapters. A simple-swap mechanism with a thumbscrew and pull-tab enables tool-less installation and removal of the adapter. The adapter supports shared BMC network sideband connectivity to enable out-of-band systems management.
- The server offers PCI Express 5.0 I/O expansion capabilities that doubles the theoretical maximum bandwidth of PCIe 4.0 (32GT/s in each direction for PCIe Gen 5, compared to 16 GT/s with PCIe Gen 4 and 8 GT/s with PCIe Gen 3). A PCIe 5.0 x16 slot provides 128 GB/s bandwidth, enough to support a dual-port 200GbE network connection.
Availability and serviceability
The SR630 V3 provides many features to simplify serviceability and increase system uptime:
- Designed to run 24 hours a day, 7 days a week
- The server offers Single Device Data Correction (SDDC, also known as Chipkill), Adaptive Double-Device Data Correction (ADDDC, also known as Redundant Bit Steering or RBS), and memory mirroring for redundancy in the event of a non-correctable memory failure. Note: ADDDC in not supported with 9x4 RDIMMs.
- The server offers hot-swap drives, supporting RAID redundancy for data protection and greater system uptime.
- Available M.2 boot adapters support RAID-1 (using Intel VROC) which can enable two SATA or two NVMe M.2 drives to be configured as a redundant pair.
- The server has up to two hot-swap redundant power supplies and up to eight hot-swap redundant fans to provide availability for business-critical applications.
- Optional front-accessible slots and drives so that most major components and cables (except power) are located at the front of the server
- The light path diagnostics feature uses LEDs to lead the technician to failed (or failing) components, which simplifies servicing, speeds up problem resolution, and helps improve system availability.
- Solid-state drives (SSDs) offer more reliability and performance than traditional mechanical HDDs for greater uptime.
- Proactive Platform Alerts (including PFA and SMART alerts): Processors, voltage regulators, memory, internal storage (SAS/SATA HDDs and SSDs, NVMe SSDs, M.2 storage, flash storage adapters), fans, power supplies, RAID controllers, server ambient and subcomponent temperatures. Alerts can be surfaced through the XClarity Controller to managers such as Lenovo XClarity Administrator, VMware vCenter, and Microsoft System Center. These proactive alerts let you take appropriate actions in advance of possible failure, thereby increasing server uptime and application availability.
- The built-in XClarity Controller continuously monitors system parameters, triggers alerts, and performs recovery actions in case of failures to minimize downtime.
- Built-in diagnostics in UEFI, using Lenovo XClarity Provisioning Manager, speed up troubleshooting tasks to reduce service time.
- Lenovo XClarity Provisioning Manager supports diagnostics and can save service data to a USB key drive or remote CIFS share folder for troubleshooting and reduce service time.
- Auto restart in the event of a momentary loss of AC power (based on power policy setting in the XClarity Controller service processor)
- Offers a diagnostics port on the front of the server to allow you to attach an external diagnostics handset for enhanced systems management capabilities.
- Support for the XClarity Administrator Mobile app running on a supported smartphone or tablet and connected to the server through the service-enabled USB port, enables additional local systems management functions.
- Three-year or one-year customer-replaceable unit and onsite limited warranty (varies by geography), 9 x 5 next business day. Optional service upgrades are available.
Manageability and security
Systems management features simplify local and remote management of the SR630 V3:
- The server includes XClarity Controller 2 (XCC2) to monitor server availability. Optional upgrade to XCC Platinum to provide remote control (keyboard video mouse) functions, support for the mounting of remote media files (ISO and IMG image files), boot capture, power capping and new XCC2 Platinum features. New XCC2 Platinum features include System Guard, new security modes including a CNSA-compliant mode, a FIPS 140-3-compliant mode and enhanced NIST 800-193 support, and a new Neighbor Group feature.
- Dedicated Ethernet port at the rear of the server for remote management (BMC management). Optional support for a second dedicated BMC management port, installed in the OCP adapter bay.
- Lenovo XClarity Administrator offers comprehensive hardware management tools that help to increase uptime, reduce costs and improve productivity through advanced server management capabilities.
- UEFI-based Lenovo XClarity Provisioning Manager, accessible from F1 during boot, provides system inventory information, graphical UEFI Setup, platform update function, RAID Setup wizard, operating system installation function, and diagnostic functions.
- Support for Lenovo XClarity Energy Manager which captures real-time power and temperature data from the server and provides automated controls to lower energy costs.
- An integrated industry-standard Unified Extensible Firmware Interface (UEFI) enables improved setup, configuration, and updates, and simplifies error handling.
- Support for industry standard management protocols, IPMI 2.0, SNMP 3.0, Redfish REST API, serial console via IPMI
- An integrated hardware Trusted Platform Module (TPM) supporting TPM 2.0 enables advanced cryptographic functionality, such as digital signatures and remote attestation.
- Administrator and power-on passwords help protect from unauthorized access to the server.
- Supports Secure Boot to ensure only a digitally signed operating system can be used. Supported with HDDs and SSDs, as well as 7mm and M.2 drives.
- Industry-standard Advanced Encryption Standard (AES) NI support for faster, stronger encryption.
- Intel Execute Disable Bit functionality can prevent certain classes of malicious buffer overflow attacks when combined with a supported operating system.
- Intel Trusted Execution Technology provides enhanced security through hardware-based resistance to malicious software attacks, allowing an application to run in its own isolated space, protected from all other software running on a system.
- Additional physical security features are an available chassis intrusion switch and available lockable front bezel.
Energy efficiency
The SR630 V3 offers the following energy-efficiency features to save energy, reduce operational costs, and increase energy availability:
- The server supports an advanced direct-water cooling (DWC) capability with the Lenovo Neptune Processor DWC Module, where heat from the processors is removed from the rack and the data center using an open loop and coolant distribution units, resulting in lower energy costs
- Energy-efficient system board components help lower operational costs.
- High-efficiency power supplies with 80 PLUS Platinum and Titanium certifications
- Solid-state drives (SSDs) consume as much as 80% less power than traditional spinning 2.5-inch HDDs.
- Support for Lenovo XClarity Energy Manager provides advanced data center power notification, analysis, and policy-based management to help achieve lower heat output and reduced cooling needs.
- The server uses hexagonal ventilation holes, which can be grouped more densely than round holes, providing more efficient airflow through the system and thus keeping your system cooler.
Comparing the SR630 V3 to the SR630 V2
The ThinkSystem SR630 V3 improves on the previous generation SR630 V2, as summarized in the following table.
Components and connectors
The following figure shows the front of the SR630 V3.
Figure 2. Front view of the ThinkSystem SR630 V3 with 2.5-inch drive bays
For details on the front ports, including the optional front VGA port and front external diagnostic port, see the Local management section.
The following figure shows the various front configurations supported by the SR630 V3. As shown, the server supports 2.5-inch, 3.5-inch or E1.S EDSFF drive bays. In some configurations, the front of the server includes a pull-out operator panel with LCD display. The SR630 V3 also supports a configuration with 4x 2.5-inch drive bays + 3x front-accessible PCIe slots - a low-profile slot, a full-height slot, and an OCP 3.0 slot.
Figure 3. Front configurations of the ThinkSystem SR630 V3
The following figure shows the components visible from the rear of the server. As shown, there are five different configurations available, including two with rear-mounted drive bays: two 2.5-inch hot-swap drive bays (SAS, SATA or NVMe) or 7mm thickness hot-swap drives (SATA or NVMe). There are two configurations with a full-height slot, one where both slots are connected to CPU 1, and the other where the full-height slot is connected to CPU 2.
Standard specifications
The following table lists the standard specifications.
Components | Specification |
---|---|
Machine types | 7D72 - 1 year warranty 7D73 - 3 year warranty |
Form factor | 1U rack. |
Processor | One or two 5th Gen Intel Xeon Scalable processors (formerly codenamed "Emerald Rapids"), or one or two 4th Gen Intel Xeon Scalable processors (formerly codenamed "Sapphire Rapids"). Supports processors up to 64 cores, core speeds of up to 3.9 GHz, and TDP ratings of up to 385 W. |
Chipset | Intel C741 "Emmitsburg" chipset, part of the platform codenamed "Eagle Stream" |
Memory | 32 DIMM slots with two processors (16 DIMM slots per processor). Each processor has 8 memory channels, with 2 DIMMs per channel (DPC). Lenovo TruDDR5 RDIMMs, 9x4 RDIMMs, and 3DS RDIMMs are supported. DIMMs operate at up to 5600 MHz at 1 DPC and up to 4800 MHz at 2 DPC. |
Persistent memory | No support. Supports up to 16x Intel Optane Persistent Memory 300 Series modules (8 per processor) installed in the DIMM slots. Persistent memory (Pmem) is installed in combination with system memory DIMMs. |
Memory maximum | With RDIMMs: Up to 8TB by using 32x 256GB 3DS RDIMMs With Persistent Memory: Up to 12TB by using 16x 256GB 3DS RDIMMs and 16x 512GB Pmem modules |
Memory protection | ECC, SDDC (for x4-based memory DIMMs), ADDDC (for x4-based memory DIMMs excluding 9x4 RDIMMs, requires Platinum or Gold processors), and memory mirroring. |
Disk drive bays |
Up to 4x 3.5-inch or 12x 2.5-inch or 16x EDSFF hot-swap drive bays:
See Supported drive bay combinations for details. AnyBay bays support SAS, SATA or NVMe drives. NVMe bays only support NVMe drives. Rear drive bays can be used in conjunction with 2.5-inch front drive bays. The server supports up to 12x NVMe drives all with direct connections (no oversubscription). |
Maximum internal storage |
|
Storage controller |
|
Optical drive bays | No internal optical drive. |
Tape drive bays | No internal backup drive. |
Network interfaces | Dedicated OCP 3.0 SFF slot with PCIe 5.0 x16 host interface. Supports a variety of 2-port and 4-port adapters with 1, 10, 25 and 100 GbE network connectivity. One port can optionally be shared with the XClarity Controller (XCC) management processor for Wake-on-LAN and NC-SI support. |
PCI Expansion slots |
Up to 5x slots, 3x at the rear and 2x at the front, plus 1 OCP 3.0 slot. Rear: Up to 3x PCIe slots (2x PCIe 5.0, 1x PCIe 4.0), all with rear access, plus a slot dedicated to the OCP adapter. Slot availability is based on riser selection and rear drive bay selection. Slot 3 requires two processors. Four choices for rear-access slots:
For 2.5-inch front drive configurations, the server supports the installation of a CFF RAID adapter or HBA in a dedicated area that does not consume any of the PCIe slots. Front: The server also supports slots at the front of the server:
Note: Not all slots are available in a 1-processor configuration. See the I/O expansion for details. |
GPU support | Supports up to 3x single-wide GPUs |
Ports |
Front: 1x USB 3.2 G1 (5 Gb/s) port, 1x USB 2.0 port (also for XCC local management), External diagnostics port, optional VGA port. Rear: 3x USB 3.2 G1 (5 Gb/s) ports, 1x VGA video port, 1x RJ-45 1GbE systems management port for XCC remote management. Optional DB-9 COM serial port (installs in slot 3). Optional second RJ-45 1GbE systems management port for XCC remote management (installed in OCP adapter slot). Internal: 1x USB 3.2 G1 connector for operating system or license key purposes |
Cooling | Up to 8x N+1 dual-rotor redundant hot-swap 40 mm fans, configuration dependent. One fan integrated in each power supply. For high-performance CPUs, the SR630 V3 also offers a closed-loop liquid-cooled heatsink design to more effectively remove heat from the processors. For customers with water infrastructure in their data center, the SR630 V3 also offers open-loop water cooling for efficient heat removal. |
Power supply | Up to two hot-swap redundant AC power supplies, 80 PLUS Platinum or 80 PLUS Titanium certification. 750 W, 1100 W and 1800 W AC options, supporting 220 V AC. 750 W and 1100 W options also support 110V input supply. In China only, all power supply options support 240 V DC. Also available is a 1100W power supply with a -48V DC input. |
Video | Embedded graphics with 16 MB memory with 2D hardware accelerator, integrated into the XClarity Controller 2 management controller. Maximum resolution is 1920x1200 32bpp at 60Hz. |
Hot-swap parts | Drives, power supplies, and fans. |
Systems management | Operator panel with status LEDs. Optional External Diagnostics Handset with LCD display. Models with 8x 2.5-inch front drive bays can optionally support an Integrated Diagnostics Panel. XClarity Controller 2 (XCC2) embedded management based on the ASPEED AST2600 baseboard management controller (BMC), XClarity Administrator centralized infrastructure delivery, XClarity Integrator plugins, and XClarity Energy Manager centralized server power management. Optional XCC Platinum to enable remote control functions and other features. |
Security features | Chassis intrusion switch, Power-on password, administrator's password, Root of Trust module supporting TPM 2.0 and Platform Firmware Resiliency (PFR). Optional lockable front security bezel. |
Operating systems supported | Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESXi, Ubuntu Server. See the Operating system support section for specifics. |
Limited warranty | Three-year or one-year (model dependent) customer-replaceable unit and onsite limited warranty with 9x5 next business day (NBD). |
Service and support | Optional service upgrades are available through Lenovo Services: 4-hour or 2-hour response time, 6-hour fix time, 1-year or 2-year warranty extension, software support for Lenovo hardware and some third-party applications. |
Dimensions | Width: 440 mm (17.3 in.), height: 43 mm (1.7 in.), depth: 773 mm (30.4 in.). See Physical and electrical specifications for details. |
Weight | Maximum weight: 20.8 kg (45.9 lb) |
Models
ThinkSystem SR630 V3 models can be configured by using the Lenovo Data Center Solution Configurator (DCSC).
Topics in this section:
CTO models
ThinkSystem SR630 V3 models can be configured by using the Lenovo Data Center Solution Configurator (DCSC).
Configure-to-order (CTO) models are used to create models with factory-integrated server customizations. For CTO models, two types of base CTO models are available for the SR630 V3 as listed in the columns in the following table:
- General purpose base CTO models are for general business (non-HPC) and is selectable by choosing General Purpose mode in DCSC.
- AI and HPC base models are intended for Artificial Intelligence (AI) and High Performance Computing (HPC) configurations and solutions are enabled using the AI & HPC Hardware - ThinkSystem Hardware mode in DCSC. These configurations, along with Lenovo EveryScale Solutions, can also be built using System x and Cluster Solutions Configurator (x-config). Tip: Some HPC and AI models are not listed in DCSC and can only be configured in x-config.
Controlled GPU models: The "Controlled GPU" base CTO models listed in the table are the only models that support high-performance GPUs and accelerators. These models are classified under US Government ECCN regulations and have limited market and customer availability. All other base models do not support high-performance GPUs.
Preconfigured server models may also be available for the SR630 V3, however these are region-specific; that is, each region may define their own server models, and not all server models are available in every region.
The following table lists the base CTO models of the ThinkSystem SR630 V3 server.
Base feature codes
Models of the SR630 V3 are defined based on whether the server has 2.5-inch drive bays at the front (called the 10x 2.5" chassis or simply the 2.5-inch chassis) or whether it has 3.5-inch drive bays at the front (called the 3.5-inch chassis). For models, the feature codes for these chassis bases are as listed in the following table.
Preconfigured models
The following tables list the available preconfigured models, grouped by region.
- Models for Asia Pacific region
- Models for Australia and New Zealand
- Models for Brazil
- Models for EMEA region
- Models for India
- Models for Japan
- Models for Latin American countries (except Brazil)
- Models for USA and Canada
Refer to the Specifications section for information about standard features of the server.
Common to all models:
- Power supplies are Platinum unless otherwise stated
- All models include a Toolless Slide Rail Kit
Models for Asia Pacific region
The following table lists the models for the Asia Pacific region: Australia, Bangladesh, Brunei, Hong Kong, India, Japan, Korea, Sri Lanka, Malaysia, New Zealand, Philippines, Singapore, Thailand, Taiwan, Vietnam
† Processor description: Processor model, number of cores, thermal design power (TDP), core frequency
Models for Australia and New Zealand
Common to all Australia and New Zealand models:
- All models include a Toolless Slide Rail Kit and Cable Management Arm
† Processor description: Processor model, number of cores, thermal design power (TDP), core frequency
Models for Brazil
† Processor description: Processor model, number of cores, thermal design power (TDP), core frequency
Models for EMEA region
† Processor description: Processor model, number of cores, thermal design power (TDP), core frequency
Models for India
AP models: Customers in India also have access to the Asia Pacific region models.
† Processor description: Processor model, number of cores, thermal design power (TDP), core frequency
Models for Japan
† Processor description: Processor model, number of cores, thermal design power (TDP), core frequency
Models for Latin American countries (except Brazil)
† Processor description: Processor model, number of cores, thermal design power (TDP), core frequency
Models for USA and Canada
† Processor description: Processor model, number of cores, thermal design power (TDP), core frequency
Processors
The SR630 V3 supports processors in the 4th Gen Intel Xeon Scalable Processor family. The server supports one or two processors.
Topics in this section:
Processor options
All supported processors have the following characteristics:
- 8 DDR5 memory channels at 2 DIMMs per channel
- Up to 4 UPI links between processors at up to 20 GT/s
- Up to 80 PCIe 5.0 I/O lanes
The following table lists the 5th Gen processors that are currently supported by the SR630 V3.
* These processors are single-socket capable processors and are only available in configure-to-order builds or in preconfigured models. Not available as option part numbers.
The following table lists the 4th Gen processors that are currently supported by the SR630 V3.
* These processors are single-socket capable processors and are only available in configure-to-order builds or in preconfigured models. Not available as option part numbers.
Configuration notes:
- Processor options include a heatsink but do not include a system fan
Processor features
Processors supported by the SR630 V3 introduce new embedded accelerators to add even more processing capability:
- QuickAssist Technology (Intel QAT)
Help reduce system resource consumption by providing accelerated cryptography, key protection, and data compression with Intel QuickAssist Technology (Intel QAT). By offloading encryption and decryption, this built-in accelerator helps free up processor cores and helps systems serve a larger number of clients.
- Intel Dynamic Load Balancer (Intel DLB)
Improve the system performance related to handling network data on multi-core Intel Xeon Scalable processors. Intel Dynamic Load Balancer (Intel DLB) enables the efficient distribution of network processing across multiple CPU cores/threads and dynamically distributes network data across multiple CPU cores for processing as the system load varies. Intel DLB also restores the order of networking data packets processed simultaneously on CPU cores.
- Intel Data Streaming Accelerator (Intel DSA)
Drive high performance for storage, networking, and data-intensive workloads by improving streaming data movement and transformation operations. Intel Data Streaming Accelerator (Intel DSA) is designed to offload the most common data movement tasks that cause overhead in data center-scale deployments. Intel DSA helps speed up data movement across the CPU, memory, and caches, as well as all attached memory, storage, and network devices.
- Intel In-Memory Analytics Accelerator (Intel IAA)
Run database and analytics workloads faster, with potentially greater power efficiency. Intel In-Memory Analytics Accelerator (Intel IAA) increases query throughput and decreases the memory footprint for in-memory database and big data analytics workloads. Intel IAA is ideal for in-memory databases, open source databases and data stores like RocksDB, Redis, Cassandra, and MySQL.
- Intel Advanced Matrix Extensions (Intel AMX)
Intel Advanced Matrix Extensions (Intel AMX) is a built-in accelerator in all Silver, Gold, and Platinum processors that significantly improves deep learning training and inference. With Intel AMX, you can fine-tune deep learning models or train small to medium models in just minutes. Intel AMX offers discrete accelerator performance without added hardware and complexity.
The processors also support a separate and encrypted memory space, known as the SGX Enclave, for use by Intel Software Guard Extensions (SGX). The size of the SGX Enclave supported varies by processor model. Intel SGX offers hardware-based memory encryption that isolates specific application code and data in memory. It allows user-level code to allocate private regions of memory (enclaves) which are designed to be protected from processes running at higher privilege levels.
The following table summarizes the key features of all supported 5th Gen processors in the SR630 V3.
† The maximum single-core frequency at with the processor is capable of operating
* L3 cache is 1.875 MB per core or larger. Processors with a larger L3 cache per core are marked with an *
** Bronze 3508U aprocessor does not support Hyper-Threading Technology
‡ SKUs with a U suffix as well as some other SKUs have no UPI links and are are single-socket only
The following table summarizes the key features of all supported 4th Gen processors in the SR630 V3.
† The maximum single-core frequency at with the processor is capable of operating
* L3 cache is 1.875 MB per core or larger. Processors with a larger L3 cache per core are marked with an *
** Bronze 3408U processor does not support Hyper-Threading Technology
‡ SKUs with a U suffix as well as some other SKUs have no UPI links and are are single-socket only
Intel On Demand feature licensing
Intel On Demand is a licensing offering from Lenovo for certain 4th Gen and 5th Gen Intel Xeon Scalable processors that implements software-defined silicon (SDSi) features. The licenses allow customers to activate the embedded accelerators and to increase the SGX Enclave size in specific processor models as their workload and business needs change.
The available upgrades are the following:
- Up to 4x QuickAssist Technology (Intel QAT) accelerators
- Up to 4x Intel Dynamic Load Balancer (Intel DLB) accelerators
- Up to 4x Intel Data Streaming Accelerator (Intel DSA) accelerators
- Up to 4x Intel In-Memory Analytics Accelerator (Intel IAA) accelerators
- 512GB SGX Enclave, an encrypted memory space for use by Intel Software Guard Extensions (SGX)
See the Processor features section for a brief description of each accelerator and the SGX Enclave.
The following table lists the ordering information for the licenses. Accelerator licenses are bundled together based on the suitable workloads each would benefit with the additional accelerators.
Licenses can be activated in the factory (CTO orders) using feature codes, or as field upgrades using the option part numbers. With the field upgrades, they allow customers to only activate the accelerators or to increase the SGX Enclave size when their applications can best take advantage of them.
Intel On Demand is licensed on individual processors. For servers with two processors, customers will need a license for each processor and the licenses of the two processors must match. If customers add a second processor as a field upgrade, then you must ensure that the Intel On Demand licenses match the first processor.
Each license enables a certain quantity of embedded accelerators - the total number of accelerators available after activation is listed in the table. For example, Intel On Demand Communications & Storage Suite 4 (4L47A89451), once applied to the server, will result in a total of 4x QAT, 4x DLB and 4x DSA accelerators to be enabled the processor. The number of IAA accelerators is unchanged in this example.
The following table lists the 5th Gen processors that support Intel on Demand. The table shows the default accelerators and default SGX Enclave size, and it shows (with green highlight) what the total new accelerators and SGX Enclave would be once the Intel On Demand features have been activated.
The following table lists the 4th Gen processors that support Intel on Demand. The table shows the default accelerators and default SGX Enclave size, and it shows (with green highlight) what the total new accelerators and SGX Enclave would be once the Intel On Demand features have been activated.
Configuration rules:
- Not all processors support Intel On Demand upgrades - see the table for those that do not support Intel On Demand
- Upgrades can be performed in the factory (feature codes) or in the field (part numbers) but not both, and only one time
- Upgrades cannot be removed once activated
- SGX Enclave upgrades are independent of the accelerator upgrades; install either or both as desired
- For processors that support more than one upgrade, all upgrades must be performed at the same time
- Only one of each type of upgrade can be applied to a processor (eg 2x BX9A is not supported; 4x BX9B is not supported)
- The following processors support two accelerator upgrades, Intel On Demand Analytics Suite 4 (4L47A89452) and Intel On Demand Communications & Storage Suite 4 (4L47A89451); the table(s) above shows the accelerators based on both upgrades being applied.
- Intel Xeon Platinum 8460Y+
- Intel Xeon Platinum 8480+
- Intel Xeon Platinum 8568Y+
- Intel Xeon Platinum 8592+
- The number of accelerators listed for each upgrade is the number of accelerators that will be active one the upgrade is complete (ie the total number, not the number to be added)
- If a server has two processors, then two feature codes must be selected, one for each processor. The upgrades on the two processors must be identical.
- If a one-processor server with Intel On Demand features activated on it has a 2nd processor added as a field upgrade, the 2nd processor must also have the same features activated by purchasing the appropriate part numbers.
One-processor configurations
The SR630 V3 can be used with only one processor installed. Most core functions of the server (including the XClarity Controller) are connected to processor 1 as shown in the System architecture section.
With only one processor, the server has the following capabilities:
- 16 memory DIMMs for a 2TB maximum
- Two PCIe slots, Slot 1 and Slot 2 are available; Slot 3 is not available
- OCP 3.0 slot
- Up to 4x NVMe front drives using onboard connections
- 7mm drives
- M.2 drives
- Internal RAID adapter or HBA (CFF form factor)
Thermal requirements by processor
For processors with a TDP of more than 300W, the server can be configured in one of the following ways:
- Configure the open-loop liquid processor cooling, as described in the Lenovo Neptune Processor DWC Module section below, or
- Configure the closed-loop liquid processor cooling, as described in the Lenovo Neptune Liquid to Air Module section below, or
- Limit the drive backplanes used to only one of the 4-bay front drive backplanes (features BCGB or BPC9 as described in the Front drive bays section)
For additional thermal requirements for processors, see the Thermal Rules section in the Lenovo Docs site for the SR630 V3:
https://pubs.lenovo.com/sr630-v3/thermal_rules
The SR630 V3 supports four different processor cooling solutions, depending on the configuration, as listed in the following table.
Feature code | Description | Purpose |
---|---|---|
BPFK | Standard Heatsink | Standard 1U heatsink. Automatically selected based on the server configuration. |
BP50 | ThinkSystem SR630 V3 Performance Heatsink (Neptune Thermal Transfer Module) | Performance 1U heatsink with two satellite heatsinks. Automatically selected based on the server configuration. |
BRU2 | ThinkSystem SR630 V3 Neptune Liquid to Air Module | Enables closed-loop liquid cooling of the processors. See the Lenovo Neptune Liquid to Air Module section. |
BXBC | ThinkSystem V3 1U/2U Neptune Processor Direct Water Cooling Module | Enables open-loop liquid cooling of the processors. See the Lenovo Neptune Processor DWC Module section. |
The selection of the heatsink will be automatically derived by the configurator and depends on the processor and other components selected. Use the tables in the Lenovo Docs site to determine the requirements for each heatsink:
https://pubs.lenovo.com/sr630-v3/thermal_rules
Lenovo Neptune Liquid to Air Module - Closed-loop liquid cooling
The Lenovo Neptune Liquid to Air (L2A) Module is a closed-loop liquid-cooled processor heatsink, and is primarily used for processors with a TDP of more than 300W. Without the closed-loop heatsink, the use of processors > 300W TDP requires that only 4x front 2.5-inch drive bays be configured. The use of the closed-loop heatsink allows for 10x SAS/SATA or NVMe drives bays.
Ambient temperature: The use of the closed-loop liquid-cooled heatsinks requires that the ambient temperature be no more than 25°C.
The following figure shows the placement of the components in the closed-loop liquid-cooled solution. Cold plates are mounted on top of each processor and these are connected via aluminum tubes to a radiator that is placed in front of the system fans. The tubes contain a mixture of water and ethylene glycol (EGW). The liquid is actively pumped through the pipes in a closed loop to remove the heat from the processors.
Figure 7. SR630 V3 with Neptune Liquid to Air Module
The Neptune Liquid to Air Module is only available in CTO orders, not as a field upgrade. Ordering information is listed in the following table.
Part number | Feature code | Description |
---|---|---|
CTO only | BRU2* | ThinkSystem SR630 V3 Neptune Liquid to Air Module |
* In DCSC, this feature code is listed in the Processor tab
To enable closed-loop liquid-cooled heatsink in the DCSC configurator:
- Select Base as ThinkSystem V3 1U 10x2.5" Chassis (feature BLK4)
- Select Datacenter Environment of 25 Degrees Celsius (feature BL0H)
- Select ThinkSystem SR630 V3 Neptune Liquid to Air Module (feature BRU2)
- Select a processor with TDP > 300W
The closed-loop liquid-cooled heatsink has the following requirements:
- Either one or two CPUs are supported
- One of the following 2.5-inch front drive bay configurations:
- 10x 2.5'' SAS/SATA
- 10x 2.5'' NVMe
- 6x SAS/SATA + 2x AnyBay + 2x NVMe
- 6x SAS/SATA + 4x AnyBay
- 8x 2.5'' SAS/SATA
- 8x 2.5'' U.2 drives with one processor
- 3.5-inch and EDSFF front drive bays are not supported
- If a RAID 940 or 9350 adapter is configured:
- RAID supercap must be installed in slot 3
- 7mm drives are not supported
- The following components are not supported:
- Persistent memory
- 256GB 3DS RDIMMs
- Rear 2.5-inch drives
- GPUs
- M.2 drives
- Any internal RAID/HBAs (CFF form factor)
- 25°C ambient temperature
For more information, see the Thermal Rules page for the Liquid to Air Module:
https://pubs.lenovo.com/sr630-v3/thermal_rules#thermal_rules__thermal_rules_for_servers_with_lacm
Lenovo Processor Neptune Core Module - Open-loop liquid cooling
The SR630 V3 also supports advanced direct-water cooling (DWC) capability with the Lenovo Processor Neptune Core Module. This module implements a liquid cooling solution where heat from the processors is removed from the rack and the data center using an open loop and coolant distrubution units.
With the Processor Neptune Core Module, all heat generated by the processors is removed from the server using water. This means that the server fans and data center air conditioning units only need to remove the heat generated by the other components. This results in lower air conditioning costs and it enables the use of slower fans which results in lower overall power consumption.
Typical power saving of 26% (up to 17.2KW per rack) are possible, based on 35x SR630 V3 servers in a rack (DC level PUE weighted) at 30°C ambient temperature. Power savings are configuration dependent.
The following figure shows the Lenovo Processor Neptune Core Module.
Figure 8. Lenovo Processor Neptune Core Module
The Processor Neptune Core Module also includes a leak detection module which can detect a leakage of more than 0.5ml (about 10 drops) along the length of the tube and then issue an event to the XClarity Controller. XCC will then post an error to the System Event Log and enable further actions. Once the liquid evaporates, a further event is issue to XCC.
The Processor Neptune Core Module is only available in CTO orders, not as a field upgrade. Ordering information is listed in the following table.
Part number | Feature code | Description |
---|---|---|
CTO only | BXBC* | ThinkSystem V3 1U/2U Neptune Processor Direct Water Cooling Solution |
* In DCSC, this feature code is listed in the Processor tab
Configuration notes:
- The Processor Neptune Core Module requires water infrastructure be available in the rack cabinet and data center, as described in the Water infrastructure section.
- All processor SKUs are supported
- Either one or two CPUs are supported
- All front drive bay configurations are supported
- Slot 2 is not available for adapters - the water loop is routed through the space otherwise occupied by slot 2
- Only the following slot configurations are supported:
- 2x Low profile x16 slots, in slot 1 and slot 3
- 1x Low profile x16 slot in slot 1, and 2x 7mm drives in slot 3
- Rear 2.5-inch drive bays are not supported
- RAID flash power module (supercap) support is limited only to positions 1 (2.5-inch drives only) or position 3 (slot 3), as described in the RAID flash power module (supercap) support section. Location 2 on the air baffle is not supported.
- M.2 adapters are supported based on the configurations in the Storage configurations section
- Standard fans can be configured in most configurations
- The use of a cable management arm (CMA) is not supported
For more information, see the Thermal Rules page for the direct water cooling module:
https://pubs.lenovo.com/sr630-v3/thermal_rules#server-models-with-direct-water-cooling-module
The following figure shows the Lenovo Neptune Processor DWC Module installed in the SR630 V3.
Figure 9. Lenovo Neptune Processor DWC Module installed in the SR630 V3
UEFI operating modes
The SR630 V3 offers preset operating modes that affect energy consumption and performance. These modes are a collection of predefined low-level UEFI settings that simplify the task of tuning the server to suit your business and workload requirements.
The following table lists the feature codes that allow you to specify the mode you wish to preset in the factory for CTO orders.
The preset modes for the SR630 V3 are as follows:
- Maximum Performance Mode (feature BFYB): Achieves maximum performance but with higher power consumption and lower energy efficiency.
- Minimal Power Mode (feature BFYC): Minimize the absolute power consumption of the system.
- Efficiency Favoring Power Savings Mode (feature BFYD): Maximize the performance/watt efficiency with a bias towards power savings. This is the favored mode for SPECpower benchmark testing, for example.
- Efficiency Favoring Performance Mode (feature BFYE): Maximize the performance/watt efficiency with a bias towards performance. This is the favored mode for Energy Star certification, for example.
For details about these preset modes, and all other performance and power efficiency UEFI settings offered in the SR630 V3, see the paper "Tuning UEFI Settings for Performance and Energy Efficiency on Intel Xeon Scalable Processor-Based ThinkSystem Servers", available from https://lenovopress.lenovo.com/lp1477.
Memory options
The SR630 V3 uses Lenovo TruDDR5 memory operating at up to 5600 MHz. The server supports up to 32 DIMMs with 2 processors. The processors have 8 memory channels and support 2 DIMMs per channel (DPC). The server supports up to 8TB of memory using 32x 256GB 3DS RDIMMs and two processors.
With 5th Gen Intel Xeon processors, DIMMs operate at the following speeds, up to the memory bus speed of the processor selected. See the Processor features section for specifics.
- 1 DIMM per channel (DPC) using RDIMMs: Up to 5600 MHz
- 1 DPC using 3DS RDIMMs: Up to 5200 MHz
- 2 DPC using RDIMMs or 3DS RDIMMs: Up to 4400 MHz
- 2 DPC using Performance+ RDIMMs: Up to 4800 MHz
With 4th Gen Intel Xeon processors, DIMMs operate at the following speeds, up to the memory bus speed of the processor selected:
- 1 DPC: Up to 4800 MHz
- 2 DPC: Up to 4400 MHz
Lenovo TruDDR5 memory uses the highest quality components that are sourced from Tier 1 DRAM suppliers and only memory that meets the strict requirements of Lenovo is selected. It is compatibility tested and tuned to maximize performance and reliability. From a service and support standpoint, Lenovo TruDDR5 memory automatically assumes the system warranty, and Lenovo provides service and support worldwide.
The following table lists the 5600 MHz memory options that are currently supported by the SR630 V3. These DIMMs are only supported with 5th Gen Intel Xeon processors, except the four specific 5th Gen processors listed in the memory rules below.
The following table lists the 4800 MHz memory options that are currently supported by the SR630 V3. These DIMMs are only supported with 4th Gen Intel Xeon processors plus four specific 5th Gen processors as listed in the memory rules below.
9x4 RDIMMs (also known as EC4 RDIMMs) are a new lower-cost DDR5 memory option supported in ThinkSystem V3 servers. 9x4 DIMMs offer the same performance as standard RDIMMs (known as 10x4 or EC8 modules), however they support lower fault-tolerance characteristics. Standard RDIMMs and 3DS RDIMMs support two 40-bit subchannels (that is, a total of 80 bits), whereas 9x4 RDIMMs support two 36-bit subchannels (a total of 72 bits). The extra bits in the subchannels allow standard RDIMMs and 3DS RDIMMs to support Single Device Data Correction (SDDC), however 9x4 RDIMMs do not support SDDC. Note, however, that all DDR5 DIMMs, including 9x4 RDIMMs, support Bounded Fault correction, which enables the server to correct most common types of DRAM failures.
For more information on DDR5 memory, see the Lenovo Press paper, Introduction to DDR5 Memory, available from https://lenovopress.com/lp1618.
The following rules apply when selecting the memory configuration:
- 4800 MHz memory is only supported with 4th Gen Intel Xeon Scalable processors. 5600 MHz memory is only supported with 5th Gen Intel Xeon Scalable processors, with only four exceptions as listed below.
- The exceptions to the above rule are the following 5th Gen processors, which only support 4800 MHz memory DIMMs:
- Intel Xeon Bronze 3508U 8C 125W 2.1GHz Processor
- Intel Xeon Silver 4509Y 8C 125W 2.6GHz Processor
- Intel Xeon Silver 4510 12C 150W 2.4GHz Processor
- Intel Xeon Silver 4510T 12C 115W 2.0GHz Processor
- The SR630 V3 only supports quantities of 1, 2, 4, 6, 8, 12, or 16 DIMMs per processor; other quantities not supported. Additional quantity requirements:
- 24GB and 48GB DIMMs are only supported in quantities 1, 6, 8 per processor (2, 4, 12, 16 not supported)
- 96GB DIMMs are only supported in quantities 1, 6, 8, 12, 16 per processor (2, 4 not supported)
- The 48GB RDIMM (4X77A87033) and 96GB RDIMM (4X77A87034) are supported with all 5th Gen processors and only the following 4th Gen processors (XCC processors):
- All 4th Gen Platinum processors except 8462Y+
- Intel Xeon Gold 6414U 32C 250W 2.0GHz Processor
- Intel Xeon Gold 6430 32C 270W 2.1GHz Processor
- Intel Xeon Gold 6454S 32C 270W 2.2GHz Processor
- The server supports three types of DIMMs: 9x4 RDIMMs, RDIMMs, and 3DS RDIMMs; UDIMMs and LRDIMMs are not supported
- Mixing of DIMM types is not supported (9x4 DIMMs with 10x4 RDIMMs, 9x4 DIMMs with 3DS RDIMMs, 10x4 RDIMMs with 3DS RDIMMs)
- Mixing of DRAM technology (16Gb and 24Gb) is not supported. See the column in the above table.
- Mixing of 24GB, 48GB and 96GB DIMMs (24Gb DRAM) is not supported; if using any of these DIMMs then all installed memory must be the same part number
- Mixing x4 and x8 DIMMs is not supported
- Mixing of DIMM rank counts is supported. Follow the required installation order installing the DIMMs with the higher rank counts first.
- Mixing of DIMM capacities is supported, however only two different capacities are supported across all channels of the processor. Follow the required installation order installing the larger DIMMs first.
- Memory mirroring is not supported with 9x4 DIMMs
- The mixing of 128GB 3DS RDIMMs and 256GB 3DS RDIMMs is supported
- The use of the 128GB 3D RDIMM feature BY8F has the following requirements for thermal reasons:
- Performance fans are required
- Rear 2.5-inch drives are not supported
- GPUs are not supported
- Additional ambient temperature requirements - see https://pubs.lenovo.com/sr630-v3/thermal_rules for information
For best performance, consider the following:
- Ensure the memory installed is at least the same speed as the memory bus of the selected processor.
- Populate all 8 memory channels.
The following memory protection technologies are supported:
- ECC detection/correction
- Bounded Fault detection/correction
- SDDC (for 10x4-based memory DIMMs; look for "x4" in the DIMM description)
- ADDDC (for 10x4-based memory DIMMs, not supported with 9x4 DIMMs)
- Memory mirroring
See the Lenovo Press article "RAS Features of the Lenovo ThinkSystem Intel Servers" for more information about memory RAS features: https://lenovopress.lenovo.com/lp1711-ras-features-of-the-lenovo-thinksystem-intel-servers
If memory channel mirroring is used, then DIMMs must be installed in pairs (minimum of one pair per processor), and both DIMMs in the pair must be identical in type and size. 50% of the installed capacity is available to the operating system. Memory rank sparing is not supported.
Persistent memory
The SR630 V3 server supports Intel Optane Persistent Memory 300 Series, a new class of memory and storage technology explicitly architected for data center usage. Persistent memory is an innovative technology that delivers a unique combination of affordable large memory capacity and persistence (non-volatility). It offers significantly lower latency than fetching data from SSDs, even NVMe SSDs, and offers higher capacities than system memory.
Persistent memory technology can help boost the performance of data-intensive applications such as in-memory analytics, databases, content delivery networks, and high performance computing (HPC), as well as deliver consistent service levels at scale with higher virtual machine and container density. When data is stored closer to the processor on nonvolatile media, applications can see significant overall improvement in performance.
Key workloads:
- Hybrid cloud, IaaS, and Virtualization: Increased VM density
- In-memory databases and data services: Higher capacity/larger databases, data reliability/quick recovery, memory performance
- AI/Analytics: Faster real-time analytics and Machine Learning Analytics
- Fast storage solutions: Increased storage capacity and performance
The following table lists the ordering information for the supported persistent memory modules.
The following are the requirements when installing persistent memory (PMem) modules:
- Only App Direct Mode is supported; Memory Mode and Mixed Mode are not supported
- All PMem modules operate at a maximum speed of 4400 MHz; any installed RDIMMs will also run at this maximum speed
- PMem is supported only with 10x4 RDIMMs and 3DS RDIMMs; PMem is not supported with 9x4 RDIMMs
- All installed PMem modules must be the same size; Mixing PMem modules of different capacities is not supported
- Maximum 8 PMem modules per processor (install 1 in each memory channel).
- For each memory channel with both a PMem module and a memory DIMM installed, the PMem module is installed in channel slot 1 (DIMM1, closer to the processor) and the DIMM is installed in channel slot 0 (DIMM0)
- To maximize performance, balance all memory channels
- Both interleaved and non-interleaved modes are supported
- Memory mirroring is only supported on the RDIMMs; Memory mirroring is not supported on the PMem modules
Internal storage
The SR630 V3 supports 4x 3.5-inch or 12x 2.5-inch or 16x EDSFF drive bays, depending on the selected chassis and backplane configuration. The server also supports configurations without any drive bays if desired.
The server supports front and rear drive bays, are as follows:
- Front:
- 4x 3.5-inch hot-swap bays, or
- Up to 10x 2.5-inch hot-swap bays, or
- 16x EDSFF hot-swap bays
- Rear:
- 2x 2.5-inch hot-swap bays, or
- 2x 7mm hot-swap drives bays
All drives are hot-swap and are accessible from the front or from the rear.
The server also supports one or two M.2 drives, installed in an M.2 adapter internal to the server.
In this section:
NVMe drive support
The SR630 V3 supports NVMe drives to maximize storage performance:
- In 2.5-inch front drive configurations, the server supports up to 12 NVMe drives without oversubscription (that is, each x4 drive has a dedicated x4 connection (4 lanes) to the processor):
- 10x 2.5-inch NVMe drives at the front
- 2x 2.5-inch NVMe drives at the rear
- In 3.5-inch front drive configurations, the server supports up to 6 NVMe drives without oversubscription:
- 4x 3.5-inch NVMe drives at the front
- 2x 2.5-inch NVMe drives at the rear
- In EDSFF front drive configurations, the server supports up to 16 NVMe drives without oversubscription:
- 16x E1.S NVMe drives at the front
The specifics of these configurations are covered in the Storage configurations section.
In addition, the SR630 V3 supports two 7mm NVMe drives for use as boot drives. These two drives optionally support RAID via a separate RAID adapter installed in a PCIe slot.
The RAID 940-8i and RAID 940-16i adapters also support NVMe through a feature named Tri-Mode support (or Trimode support). This feature enables the use of NVMe U.3 drives at the same time as SAS and SATA drives. Tri-Mode requires an AnyBay backplane. Cabling of the controller to the backplanes is the same as with SAS/SATA drives, and the NVMe drives are connected via a PCIe x1 link to the controller.
NVMe drives connected using Tri-Mode support provide better performance than SAS or SATA drives: A SATA SSD has a data rate of 6Gbps, a SAS SSD has a data rate of 12Gbps, whereas an NVMe U.3 Gen 4 SSD with a PCIe x1 link will have a data rate of 16Gbps. NVMe drives typically also have lower latency and higher IOPS compared to SAS and SATA drives. Tri-Mode is supported with U.3 NVMe drives and requires an AnyBay backplane.
Tri-Mode requires U.3 drives: Only NVMe drives with a U.3 interface are supported. U.2 drives are not supported. See the Internal drive options section for the U.3 drives supported by the server.
Front drive bays
The front drive bay zone supports the following configurations. All drives are hot-swap.
- 3.5-inch hot-swap drive bays
- 4x SAS/SATA 3.5-inch
- 4x AnyBay 3.5-inch (PCIe Gen4)
- 2.5-inch hot-swap drive bays without support for front PCIe slots
- 4x SAS/SATA
- 4x NVMe (PCIe Gen4 or Gen5)
- 8x SAS/SATA
- 10x SAS/SATA
- 6x SAS/SATA + 4x AnyBay (PCIe Gen4 or Gen5)
- 6x SAS/SATA + 2x AnyBay + 2x NVMe (PCIe Gen4 or Gen5)
- 10x AnyBay (PCIe Gen4 or Gen5)
- 10x NVMe (PCIe Gen4 or Gen5)
- 2.5-inch hot-swap drive bays with support for front PCIe slots
- 2x NVMe (PCIe Gen4)
- 4x NVMe (PCIe Gen4 or Gen5)
- 4x AnyBay (PCIe Gen5)
- EDSFF drive bays
- 16x E1.S (9.5mm or 15mm) hot-swap NVMe drive bays (PCIe Gen4)
- Drive-less 2.5-inch configuration - No backplane and no drives (supports field upgrades)
- Drive-less 3.5-inch configuration - No backplane and no drives (supports field upgrades)
These configurations are shown in the following two figures. The feature codes listed correspond to the feature codes listed in the table below the figures.
The following figure shows the supported 3.5-inch and EDSFF drive bay configurations. EDSFF drive configurations can be configured with or without an Integrated Diagnostics Panel with pull-out LCD display. See the Local management section for details.
Figure 10. SR630 V3 front drive bay configurations - 3.5-inch and EDSFF drive bays
The following figure shows the supported 2.5-inch drive bays drive bay configurations without PCIe slot support.
8x 2.5-inch drive configurations can be configured with or without an Integrated Diagnostics Panel with pull-out LCD display. See the Local management section for details.
Figure 11. SR630 V3 front drive bay configurations - 2.5-inch drive bays without front PCIe slot support
The following figure shows the supported 2.5-inch drive bays drive bay configurations with front PCIe slot support. Front slots can be used with rear slots. See the I/O expansion for details.
Figure 12. SR630 V3 front drive bay configurations - 2.5-inch drive bays with front PCIe slot support
The backplanes used to provide these drive bays are listed in the following table.
Field upgrades: Most front backplanes are available as part numbers for field upgrades using upgrade kits, as described in the Field upgrades section below.
Rear 2.5-inch and 7mm drive bays
The SR630 V3 supports hot-swap drives installed at the rear of the server chassis. Supported configurations are as follows:
- 2x 2.5-inch hot-swap SAS/SATA drive bays
- 2x 2.5-inch hot-swap NVMe drive bays (PCIe Gen 4)
- 2x 7mm SAS/SATA drive bays
- 2x 7mm NVMe drive bays (PCIe Gen 4)
The configurations are shown in the following figure.
The backplanes used to provide these drive bays in CTO orders are listed in the following table. Backplanes are also available as part numbers for field upgrades using upgrade kits, as described in the Field upgrades section below.
The SR630 V3 supports two 7mm drive options installed in slot 3:
- 7mm drive backplane supporting SATA or NVMe drives, without integrated RAID. Optional RAID functionality is provided by a separate RAID adapter installed in a slot.
- 7mm drive backplane supporting NVMe drives (no SATA support) with integrated RAID support via an onboard Marvell 88NR2241 NVMe RAID controller
The use of rear 2.5-inch drive bays has the following configuration rules:
- With 2.5-inch rear drive bays, only slot 1 is available. Slot 2 and 3 are not available
The use of the 7mm rear drive bays has the following configuration rules:
- 7mm rear drive bays occupy slot 3; slots 1 and 2 are available and slot 2 is a low profile slot. Slot 3 is not available.
- M.2 and 7mm drives are mutually exclusive: they are not supported together in the same configuration
- For ThinkSystem 7mm SATA/NVMe 2-Bay Rear Enablement Kit v2 (feature BU0N):
- The adapter supports either SATA drives or NVMe drives but not both. You specify SATA or NVMe in the configurator using feature codes BTTV (SATA) or BTTW (NVMe).
- RAID support is implemented using VROC (no adapter needed) or with the use of an additional RAID adapter installed in a slot
- If RAID is enabled using VROC, select these feature codes:
- VROC SATA support: On Board SATA Software RAID Mode for 7mm (feature BS7U)
- VROC NVMe support:
- Intel VROC (VMD NVMe RAID) Standard for 7mm (feature BS7R)
- Intel VROC RAID1 Only for 7mm (feature BZ4Y)
- If RAID is enabled using a RAID adapter, the adapter is installed in PCIe slot 1 or 2:
- RAID support for 7mm SATA drives requires a RAID 5350-8i adapter (feature BVL2)
- RAID support for 7mm NVMe drives requires a RAID 540-8i adapter operating in Tri-Mode (feature BVL4)
- The use of VROC SATA RAID is not supported by virtualization hypervisors such as ESXi, KVM, Xen, and Hyper-V. VROC NVMe RAID is supported by hypervisors, however.
- For ThinkSystem 1U 7mm Drive Kit w/ NVMe RAID (feature B8Q2)
- The adapter only supports NVMe drives
- RAID functionality is integrated into the M.2 adapter using a Marvell 88NR2241 NVMe RAID Controller
- For ThinkSystem 7mm SATA/NVMe 2-Bay Rear Hot-Swap RAID Enablement Kit (feature BYFG)
- The 7mm drive bays support either SATA drives or NVMe drives but not both.
- RAID functionality is integrated into the 7mm backplane using a Broadcom RAID Controller
Field upgrades: Rear backplanes are available as part numbers for field upgrades using upgrade kits, as described in the Field upgrades section below.
Storage configurations
This section describes the various combinations of front and rear drives that the server supports, as well as M.2 support.
Tip: These tables are based on Config Matrix V2.4 in TRD 2.6.
In this section:
- Overview - 3.5-inch front bays
- Overview - 2.5-inch front bays without front slots
- Overview - 2.5-inch front bays with front slots
- Details - 3.5-inch drive bay chassis configurations
- Details - 2.5-inch drive bay chassis configurations without front slots
- Details - 2.5-inch drive bay chassis configurations with front slots
The following tables summarize the storage configurations for the SR630 V3. For details, including processor requirements, M.2 and 7mm support, and controller selections, see the Details tables.
Overview - 3.5-inch front bays
The following table summarizes the configurations that use 3.5-inch front drive bays.
Click to jump down to the details of the 3.5-inch configurations.
Return to Storage configurations.
Overview - 2.5-inch front bays without front slots
The following table summarizes the configurations that use 2.5-inch front drive bays but do not support front PCIe slots.
Click to jump down to the details of the 2.5-inch configurations.
Return to Storage configurations.
Overview - 2.5-inch front bays with front slots
The following table summarizes the configurations that use 2.5-inch front drive bays and support front PCIe slots.
Click to jump down to the details of the 2.5-inch configurations.
Return to Storage configurations.
Details - 3.5-inch front bays
The following table lists the detailed configurations that use 3.5-inch front drive bays.
Click to go back to the overview of 3.5-inch configurations.
Return to Storage configurations.
In the table:
- M.2 + VROC (SATA) means the M.2 SATA/x4 NVMe adapter (4Y37A79663) with SATA drives. RAID is optional, provided using VROC.
- M.2 + VROC (NVMe) means the M.2 SATA/x4 NVMe adapter (4Y37A79663) with NVMe drives. RAID is optional, provided using VROC.
- M.2 + RAID adapter means the M.2 SATA/x4 NVMe adapter (4Y37A79663) with either a RAID 5350-8i adapter (supporting SATA drives) or a RAID 540-8i (supporting NVMe drives). Adapter installs in a rear PCIe slot.
- M.2 RAID (NVMe) means the M.2 RAID NVMe adapter (B8P9) with NVMe drives. SATA drives not supported. RAID-0 and RAID-1 are supported with the integrated Marvell RAID controller.
- 7mm + VROC (SATA) means the 7mm SATA/NVMe kit (BU0N) with SATA drives. RAID is optional, provided using VROC.
- 7mm + VROC (NVMe) means the 7mm SATA/NVMe kit (BU0N) with NVMe drives. RAID is optional, provided using VROC.
- 7mm + RAID adapter means the 7mm SATA/NVMe kit (BU0N) with either a RAID 5350-8i adapter (supporting SATA drives) or a RAID 540-8i (supporting NVMe drives). Adapter installs in a rear PCIe slot.
- 7mm RAID (NVMe) means the 7mm NVMe RAID kit (B8Q2) with NVMe drives. SATA drives not supported. RAID-0 and RAID-1 are supported with the integrated Marvell RAID controller.
* For M.2 and 7mm: Requires 2 processors; not supported with only 1 processor installed
Details - 2.5-inch front bays without front slots
The following table lists the detailed configurations that use 2.5-inch front drive bays without front PCIe slots.
Click to go back to the overview of 2.5-inch configurations.
Return to Storage configurations.
In the table:
- M.2 + VROC (SATA) means the M.2 SATA/x4 NVMe adapter (4Y37A79663) with SATA drives. RAID is optional, provided using VROC.
- M.2 + VROC (NVMe) means the M.2 SATA/x4 NVMe adapter (4Y37A79663) with NVMe drives. RAID is optional, provided using VROC.
- M.2 + RAID adapter means the M.2 SATA/x4 NVMe adapter (4Y37A79663) with either a RAID 5350-8i adapter (supporting SATA drives) or a RAID 540-8i (supporting NVMe drives)
- M.2 RAID (NVMe) means the M.2 RAID NVMe adapter (4Y37A09750) with NVMe drives. SATA drives not supported. RAID-0 and RAID-1 are supported with the integrated Marvell RAID controller.
- 7mm + VROC (SATA) means the 7mm SATA/NVMe kit (BU0N) with SATA drives. RAID is optional, provided using VROC.
- 7mm + VROC (NVMe) means the 7mm SATA/NVMe kit (BU0N) with NVMe drives. RAID is optional, provided using VROC.
- 7mm + RAID adapter means the 7mm SATA/NVMe kit (BU0N) with either a RAID 5350-8i adapter (supporting SATA drives) or a RAID 540-8i (supporting NVMe drives)
- 7mm RAID (NVMe) means the 7mm NVMe RAID kit (B8Q2) with NVMe drives. SATA drives not supported. RAID-0 and RAID-1 are supported with the integrated Marvell RAID controller.
* For M.2 and 7mm: Requires 2 processors; not supported with only 1 processor installed
Details - 2.5-inch front bays with front slots
The following table lists the detailed configurations that use 2.5-inch front drive bays without front PCIe slots.
Click to go back to the overview of 2.5-inch configurations.
Return to Storage configurations.
In the table:
- M.2 + VROC (SATA) means the M.2 SATA/x4 NVMe adapter (4Y37A79663) with SATA drives. RAID is optional, provided using VROC.
- M.2 + VROC (NVMe) means the M.2 SATA/x4 NVMe adapter (4Y37A79663) with NVMe drives. RAID is optional, provided using VROC.
- M.2 + RAID adapter means the M.2 SATA/x4 NVMe adapter (4Y37A79663) with either a RAID 5350-8i adapter (supporting SATA drives) or a RAID 540-8i (supporting NVMe drives)
- M.2 RAID (NVMe) means the M.2 RAID NVMe adapter (4Y37A09750) with NVMe drives. SATA drives not supported. RAID-0 and RAID-1 are supported with the integrated Marvell RAID controller.
- 7mm + VROC (SATA) means the 7mm SATA/NVMe kit (BU0N) with SATA drives. RAID is optional, provided using VROC.
- 7mm + VROC (NVMe) means the 7mm SATA/NVMe kit (BU0N) with NVMe drives. RAID is optional, provided using VROC.
- 7mm + RAID adapter means the 7mm SATA/NVMe kit (BU0N) with either a RAID 5350-8i adapter (supporting SATA drives) or a RAID 540-8i (supporting NVMe drives)
- 7mm RAID (NVMe) means the 7mm NVMe RAID kit (B8Q2) with NVMe drives. SATA drives not supported. RAID-0 and RAID-1 are supported with the integrated Marvell RAID controller.