Lenovo ThinkSystem SR665 V3 Server

The Lenovo ThinkSystem SR665 V3 is a 2-socket 2U server that features the AMD EPYC 9004 "Genoa" family of processors. With up to 128 cores per processor and support for the new PCIe 5.0 standard for I/O, the SR665 V3 offers the ultimate in two-socket server performance in a 2U form factor. The server is ideal for dense workloads that can take advantage of GPU processing and high-performance NVMe drives.

Suggested uses: Inference, virtualization, VDI, HPC, Hyperconverged infrastructure

Figure 1. Lenovo ThinkSystem SR665 V3

The SR665 V3 server is a very configuration-rich offering, supporting 30 different drive bay configurations in the front, middle and rear of the server and 6 different slot configurations at the rear of the server. This level of flexibility ensures that you can configure the server exactly the way your workload requires.

Combining performance and flexibility, the SR665 V3 server is a great choice for enterprises of all sizes. The server offers a broad selection of drive and slot configurations and offers high performance features that industries such as finance, healthcare and telco need. Outstanding reliability, availability, and serviceability (RAS) and high-efficiency design can improve your business environment and can help save operational costs.

Scalability and performance

The following features boost performance, improve scalability and reduce costs: 

• Supports one or two fourth-generation AMD EPYC 9004 processors
  • Up to 128 cores and 256 threads
  • Core speed of up to 4.1 GHz
  • TDP rating of up to 400 W
• Support for DDR5 memory DIMMs to maximize the performance of the memory subsystem:
  • Up to 24 DDR5 memory DIMMs, 12 DIMMs per processor
  • 12 memory channels per processor (1 DIMM per channel)
  • DIMM speeds up to 4800 MHz
  • Using 256GB 3DS RDIMMs, the server supports up to 6TB of system memory
• Supports up to eight single-width GPUs or three double-wide GPUs, for substantial processing power in a 2U system.
• The server is Compute Express Link (CXL) v1.1 Ready. With CXL 1.1 for next-generation workloads, you can reduce compute latency in the data center and lower TCO. CXL is a protocol that runs across the standard PCIe physical layer and can support both standard PCIe devices as well as CXL devices on the same link.
• Supports up to 40x 2.5-inch hot-swap drive bays, by using combinations of front-accessible (up to 24 bays), mid bays (8 bays) and rear-accessible (8 bays).
• Supports 20x 3.5-inch drive bays for lower-cost high-capacity HDD storage. 2.5-inch and 3.5-inch drive bays can be mixed if desired.
• Supports up to 32x NVMe drives without oversubscription of PCIe lanes (1:1 connectivity). The use of NVMe drives maximizes drive I/O performance, in terms of throughput, bandwidth, and latency.
• Supports up to 20x SATA drives using the onboard SATA controller (no additional adapter needed), enabling lower cost, high capacity storage solution for cold storage workloads.
• Supports high-speed RAID controllers from Lenovo and Broadcom providing 12 Gb SAS connectivity to the drive backplanes. A variety of PCIe 3.0 and PCIe 4.0 RAID adapters are available.
• Supports two externally accessible 7mm hot-swap drives for operating system boot functions or data storage. Optional RAID with the addition of a RAID adapter installed in a slot.
• Supports M.2 drives for convenient operating system boot functions or data storage. Available M.2 adapters support either one M.2 drive or two M.2 drives. Optional RAID with the addition of a RAID adapter installed in a slot.
• Up to 12x PCIe slots (10x rear, 2x front), plus a slot dedicated to an OCP 3.0 adapter. 2.5-inch drive configurations also support an additional internal bay for a cabled RAID adapter or HBA.
• The server has a dedicated industry-standard OCP 3.0 small form factor (SFF) slot, with a PCIe 5.0 x16 interface, supporting a variety of Ethernet network adapters. Simple-swap mechanism with thumbscrews and pull-tab enables tool-less installation and removal of the adapter. Supports shared BMC network sideband connectivity to enable out-of-band systems management.
• The server offers PCI Express 5.0 (PCIe Gen 5) I/O expansion capabilities that doubles the theoretical maximum bandwidth of PCIe 4.0 (32GT/s in each direction for PCIe 5.0, compared to 16 GT/s with PCIe 4.0). A PCIe 5.0 x16 slot provides 128 GB/s bandwidth, enough to support a 400GbE network connection.

Availability and serviceability

The server provides many features to simplify serviceability and increase system uptime:

• Designed to run 24 hours a day, 7 days a week
• The server uses ECC memory and supports memory RAS features including Single Device Data Correction (SDDC, also known as Chipkill), Patrol/Demand Scrubbing, Bounded Fault, DRAM Address Command Parity with Replay, DRAM Uncorrected ECC Error Retry, On-die ECC, ECC Error Check and Scrub (ECS), and Post Package Repair.
• The server offers hot-swap drives, supporting RAID redundancy for data protection and greater system uptime.
• Available M.2 configuration with RAID support which can enable two SATA or two NVMe M.2 drives to be configured as a redundant pair.
• The server has up to two hot-swap redundant power supplies and up to six hot-swap redundant fans to provide availability for business-critical applications.
• Optional front-accessible slots and drives so that most major components and cables (except power) are located at the front of the server
• The power-source-independent light path diagnostics uses LEDs to lead the technician to failed (or failing) components, which simplifies servicing, speeds up problem resolution, and helps improve system availability.
• Solid-state drives (SSDs) offer more reliability than traditional mechanical HDDs for greater uptime.
• Proactive Platform Alerts (including PFA and SMART alerts): Processors, voltage regulators, memory, internal storage (SAS/SATA HDDs and SSDs, NVMe SSDs, M.2 storage, flash storage adapters), fans, power supplies, RAID controllers, server ambient and subcomponent temperatures. Alerts can be surfaced through the XClarity Controller to managers such as Lenovo XClarity Administrator, VMware vCenter, and Microsoft System Center. These proactive alerts let you take appropriate actions in advance of possible failure, thereby increasing server uptime and application availability.
• The built-in XClarity Controller 2 continuously monitors system parameters, triggers alerts, and performs recovery actions in case of failures to minimize downtime.
• Built-in diagnostics in UEFI, using Lenovo XClarity Provisioning Manager, speed up troubleshooting tasks to reduce service time.
• Lenovo XClarity Provisioning Manager supports diagnostics and can save service data to a USB key drive or remote CIFS share folder for troubleshooting and reduce service time.
• Auto restart in the event of a momentary loss of AC power (based on power policy setting in the XClarity Controller service processor)
• Offers a diagnostics port on the front of the server to allow you to attach an external diagnostics handset for enhanced systems management capabilities.
• Support for the XClarity Administrator Mobile app running on a supported smartphone and connected to the server through the service-enabled USB port, enables additional local systems management functions.
• Three-year or one-year customer-replaceable unit and onsite limited warranty, 9 x 5 next business day. Optional service upgrades are available.

Manageability and security

Systems management features simplify local and remote management:

• The server includes an XClarity Controller 2 (XCC2) to monitor server availability. Optional upgrade to XCC Platinum to provide remote control (keyboard video mouse) functions, support for the mounting of remote media files, FIPS 140-3 security, enhanced NIST 800-193 support, boot capture, and other management and security features.
• Lenovo XClarity Administrator offers comprehensive hardware management tools that help to increase uptime, reduce costs and improve productivity through advanced server management capabilities.
• UEFI-based Lenovo XClarity Provisioning Manager, accessible from F1 during boot, provides system inventory information, graphical UEFI Setup, platform update function, RAID Setup wizard, operating system installation function, and diagnostic functions.
• Support for Lenovo XClarity Energy Manager which captures real-time power and temperature data from the server and provides automated controls to lower energy costs.
• An integrated industry-standard Unified Extensible Firmware Interface (UEFI) enables improved setup, configuration, and updates, and simplifies error handling.
• Support for industry standard management protocols, IPMI 2.0, SNMP 3.0, Redfish REST API, serial console via IPMI
• An integrated hardware Trusted Platform Module (TPM) supporting TPM 2.0 enables advanced cryptographic functionality, such as digital signatures and remote attestation.
• Administrator and power-on passwords help protect from unauthorized access to the server.
• Supports AMD Secure Root-of-Trust, Secure Run and Secure Move features to minimize potential attacks and protect data as the OS is booted, as applications are run and as applications are migrated from server to server.
• Supports Secure Boot to ensure only a digitally signed operating system can be used.
• Industry-standard Advanced Encryption Standard (AES) NI support for faster, stronger encryption.
• Additional physical security features are a chassis intrusion switch and a lockable front bezel.

Energy efficiency

The following energy-efficiency features help save energy, reduce operational costs, and increase energy availability:

• Energy-efficient planar components help lower operational costs.
• High-efficiency power supplies with 80 PLUS Titanium certifications
• Low-voltage 1.1V DDR5 memory offers energy savings compared to 1.2V DDR4 DIMMs, an approximately 20% decrease in power consumption
• Solid-state drives (SSDs) consume as much as 80% less power than traditional spinning 2.5-inch HDDs.
• The server uses hexagonal ventilation holes, which can be grouped more densely than round holes, providing more efficient airflow through the system and thus keeping your system cooler.
• Optional Lenovo XClarity Energy Manager provides advanced data center power notification and analysis to help achieve lower heat output and reduced cooling needs.

The ThinkSystem SR665 V3 improves on the previous generation SR665, as summarized in the following table.

The following figure shows the architectural block diagram of the SR665 V3, showing the major components and their connections.

Note that one of the xGMI links between the processors can be used instead as two PCIe 5.0 x16 connections. These PCIe connections can be used for additional NVMe drive support.

Figure 5. SR665 V3 system architectural block diagram

The following table lists the standard specifications.

ThinkSystem SR665 V3 models can be configured by using the Lenovo Data Center Solution Configurator (DCSC).

Topics in this section:

• CTO models
• CTO models for Windows 10 and Windows 11
• Base feature codes
• Preconfigured models

CTO models

ThinkSystem SR665 V3 models can be configured by using the Lenovo Data Center Solution Configurator (DCSC).

Configure-to-order (CTO) models are used to create models with factory-integrated server customizations. For CTO models, two types of base CTO models are available for the SR665 V3 as listed in the columns in the following table:

• General purpose base CTO models are for general business (non-HPC) and is selectable by choosing General Purpose mode in DCSC.
• AI and HPC base models are intended for Artificial Intelligence (AI) and High Performance Computing (HPC) configurations and solutions are enabled using the AI & HPC Hardware - ThinkSystem Hardware mode in DCSC. These configurations, along with Lenovo EveryScale Solutions, can also be built using System x and Cluster Solutions Configurator (x-config). Tip: Some HPC and AI models are not listed in DCSC and can only be configured in x-config.

Preconfigured server models may also be available for the SR665 V3, however these are region-specific; that is, each region may define their own server models, and not all server models are available in every region.

The following table lists the base CTO models of the ThinkSystem SR665 V3 server.

CTO models for Windows 10 and Windows 11

The SR665 V3 can run Windows 10 and Windows 11, however only a subset of adapters and drives can be installed. For ease of configuration, the following Base CTO models have been announced to assist building a configuration that can be used with the client operating systems. For more information, see the Windows 10 and Windows 11 section.

Base feature codes

Models of the SR665 V3 are defined based on whether the server has 2.5-inch drive bays at the front (called the 2.5-inch chassis) or whether it has 3.5-inch drive bays at the front (called the 3.5-inch chassis). For models, the feature codes for these chassis bases are as listed in the following table.

Preconfigured models

The following tables list the available preconfigured models, grouped by region.

• Models for Asia Pacific region
• Models for Australia and New Zealand
• Models for EMEA region
• Models for India
• Models for Latin American countries (except Brazil)

Refer to the Specifications section for information about standard features of the server.

The SR665 V3 supports processors in the fourth-generation AMD EPYC family of processors. The server supports one or two processors.

Topics in this section:

• Processor options
• Processor features
• xGMI cabled connection
• One-processor configurations
• Thermal requirements by processor
• Lenovo Processor Neptune Core Module - Open-loop liquid cooling
• UEFI operating modes
• Platform Secure Boot

xGMI cabled connection

As shown in the System architecture section, the server has four xGMI links between the two processors. By default, three xGMI links are used for inter-processor communications, and the fourth xGMI connection is used to provide two PCIe x16 connections for additional PCIe and NVMe devices. However, to maximize CPU-to-CPU performance, the two xGMI connectors can be joined using a cable.

Ordering information for this xGMI cable is listed in the following table.

One-processor configurations

The SR665 V3 can be used with only one processor installed. Most core functions of the server (including the XClarity Controller) are connected to processor 1 as shown in the System architecture section.

Lenovo Processor Neptune Core Module - Open-loop liquid cooling

The SR665 V3 also supports advanced direct-water cooling (DWC) capability with the Lenovo Processor Neptune Core Module. This module implements a liquid cooling solution where heat from the processors is removed from the rack and the data center using an open loop and coolant distrubution units.

With the Processor Neptune Core Module, all heat generated by the processors is removed from the server using water. This means that the server fans and data center air conditioning units only need to remove the heat generated by the other components. This results in lower air conditioning costs and it enables the use of slower fans which results in lower overall power consumption.

The following figure shows the Lenovo Processor Neptune Core Module.

Figure 6. Lenovo Processor Neptune Core Module

The Processor Neptune Core Module also includes a leak detection module which can detect a leakage of more than 0.5ml (about 10 drops) along the length of the tube and then issue an event to the XClarity Controller. XCC will then post an error to the System Event Log and enable further actions. Once the liquid evaporates, a further event is issue to XCC.

The Processor Neptune Core Module is only available in CTO orders, not as a field upgrade. Ordering information is listed in the following table.

The SR665 V3 uses Lenovo TruDDR5 memory operating at up to 4800 MHz. The server supports up to 24 DIMMs with 2 processors. The processors have 12 memory channels and support 1 DIMM per channel. The server supports up to 6TB of memory using 24x 256GB 3DS RDIMMs and two processors.

The following table lists the memory options that are available for the server.

Lenovo TruDDR5 memory uses the highest quality components that are sourced from Tier 1 DRAM suppliers and only memory that meets the strict requirements of Lenovo is selected. It is compatibility tested and tuned to maximize performance and reliability. From a service and support standpoint, Lenovo TruDDR5 memory automatically assumes the system warranty, and Lenovo provides service and support worldwide.

9x4 RDIMMs (also known as Optimized or EC4 RDIMMs) are a new lower-cost DDR5 memory option supported in ThinkSystem V3 servers. 9x4 DIMMs offer the same performance as standard RDIMMs (known as 10x4 or EC8 modules), however they support lower fault-tolerance characteristics. Standard RDIMMs and 3DS RDIMMs support two 40-bit subchannels (that is, a total of 80 bits), whereas 9x4 RDIMMs support two 36-bit subchannels (a total of 72 bits). The extra bits in the subchannels allow standard RDIMMs and 3DS RDIMMs to support Single Device Data Correction (SDDC), however 9x4 RDIMMs do not support SDDC. Note, however, that all DDR5 DIMMs, including 9x4 RDIMMs, support Bounded Fault correction, which enables the server to correct most common types of DRAM failures.

For more information on DDR5 memory, see the Lenovo Press paper, Introduction to DDR5 Memory, available from https://lenovopress.com/lp1618.

The following rules apply when selecting the memory configuration:

• The SR665 V3 supports quantities 1, 2, 4, 6, 8, 10, 12 DIMMs per processor; other quantities not supported
• The server supports four types of DIMMs: 9x4 RDIMMs, 10x4 RDIMMs, x8 RDIMMs and 3DS RDIMMs
  • UDIMMs and LRDIMMs are not supported
• Mixing of DIMM types is not supported (for example, 9x4 DIMMs with 10x4 RDIMMs)
• Mixing of DRAM technology (16Gb, 24Gb, 32Gb) is not supported. See the column in the above table.
• Mixing of 128GB 3DS RDIMMs and 256GB 3DS RDIMMs is not supported
• Mixing of 128GB 3DS RDIMMs (features BYEE and BQ3A) is not supported
• Mixing of 256GB 3DS RDIMMs (features BZPN and BQ3B) is not supported
• Mixing x4 and x8 DIMMs is not supported
• Mixing of DIMM rank counts is supported. Follow the required installation order installing the DIMMs with the higher rank counts first.
• Mixing of DIMM capacities is supported, however only two different capacities are supported across all channels of the processor (eg 16GB and 32GB). Follow the required installation order installing the larger DIMMs first.
• Memory operates at the speed of the memory bus of the processor - see the Processor features section for specifics

• The use of the 128GB 3D RDIMM feature BYEE has the following requirements for thermal reasons:
  • If CPU TDP > 240W, the combination of GPUs and 24x 2.5-inch drive bays is not supported
  • Additional ambient temperature requirements - see https://pubs.lenovo.com/sr665-v3/thermal_rules for information

Note: Memory mirroring and memory rank sparing are not supported.

The SR665 V3 has three drive bay zones and supports up to 20x 3.5-inch or 40x 2.5-inch hot-swap drive bays or a combination of drive bays, depending on the selected chassis and backplane configuration. The server also supports configurations without any drive bays if desired.

All drives are hot-swap and are accessible from the front, from the rear, or from drive bays that are located in the middle of the server (accessible when you remove the top cover of the server).

The server also supports one or two M.2 drives, installed in an M.2 adapter internal to the server.

In this section:

• NVMe drive support
• Front drive bays
• Mid drive bays
• Rear drive bays
• Storage configurations
• Field upgrades
• RAID flash power module (supercap) support
• 7mm drives
• M.2 drives
• SED encryption key management with SKLM

NVMe drive support

The SR665 V3 supports NVMe drives to maximize storage performance.

• Up to 32 NVMe drives in a 2.5-inch drive configuration, without oversubscription (that is, each x4 drive has a dedicated x4 (4 lanes) connection to the processor, either direct to the processor or via a retimer adapter)
  • Up to 24 installed in front bays
  • Up to 32 installed in front and mid bays
• Up to 8 NVMe drives in a 3.5-inch drive configuration, without oversubscription
  • All installed in mid bays

The specifics of these configurations are covered in the Storage configurations section. The tables in those sections indicate the number of NVMe drives in each configuration.

In addition, the SR665 V3 supports two 7mm NVMe drives for use as boot drives. These two drives optionally support RAID via a separate RAID adapter installed in a PCIe slot.

Figure 8. SR665 V3 front drive bay configurations - 3.5-inch drive bays

Figure 9. SR665 V3 front drive bay configurations - 2.5-inch drive bays, all the same drive type

Figure 10. SR665 V3 front drive bay configurations - 2.5-inch drive bays, combinations

Figure 11. SR665 V3 front drive bay configurations - 2.5-inch drive bays with front PCIe slots

The backplanes used to provide these drive bays are listed in the following table.

The use of front drive bays has the following configuration rules:

• The SR665 V3 also supports configurations without any drive bays, allowing for drive bay upgrades as described in the field upgrades section.
• If 3.5-inch front drive bays are used, an internal (CFF) RAID adapter or HBA is not supported as the adapter and bays occupy the same physical space
• Any 8x 2.5-inch and 16x 2.5-inch drive configuration (SAS/SATA, AnyBay, or NVMe) can optionally be configured for use with the Integrated Diagnostics Panel as described in the Local management section. 3.5-inch drive configurations do not support the Integrated Diagnostics Panel. With the Integrated Diagnostics Display, 8-bay configurations can be upgrade to 16 bays, however 16-bay configurations cannot be upgrade to 24 bays.
• If you are building a server configuration that includes the ThinkSystem 2U 24x2.5" SAS/SATA with Rear 4-Bay Expander Backplane (feature BQ2T) and the order also includes a rack cabinet, then you can configure at most 6 drives to be installed in the factory. The remaining drives must be ordered separately using the option part numbers for the drives. This requirement does not apply if the order does not include a rack cabinet. The requirement is due to the shock/vibration limits of the 24x 2.5-inch backplane.
• The use of ThinkSystem 2U 12x3.5" SAS/SATA with Rear 4-Bay Expander Backplane (BQ2S,  4XH7A86133) is not supported with Windows Server or Windows 10/11 when used with the following:
  • Any of these mid or rear backplanes:
    • ThinkSystem 2U 4x3.5" SAS/SATA Middle Backplane (BCQK)
    • ThinkSystem 2U 2x3.5" SAS/SATA Rear Backplane (BAG7)
    • ThinkSystem 1U/2U 4x3.5" SAS/SATA Backplane (B8L3)
    • ThinkSystem V3 1U/2U 4x2.5" AnyBay Backplane (BQ2U)
  • Any of these SAS HBAs:
    • ThinkSystem 440-8i SAS/SATA PCIe Gen4 12Gb HBA (BM51)
    • ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb HBA (BM50)
    • ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb Internal HBA (B8P1)

Mid drive bays

The SR665 V3 supports hot-swap drives installed in the middle of the server chassis. The drive bays are accessible by removing the top lid of the server and levering the mid drive chassis up at the front.

The following configurations are supported:

• 4x 3.5-inch hot-swap SAS/SATA drive bays
• 8x 2.5-inch hot-swap SAS/SATA drive bays
• 8x 2.5-inch hot-swap NVMe drive bays

The drive bays in the open position are shown in the following figure.

Figure 12. Mid-chassis drive bays

The backplanes used to provide these drive bays are listed in the following table.

‡ 2.5-inch drive backplanes for the mid-chassis area must be installed in pairs. NVMe and SAS/SATA cannot be mixed.

The use of drive bays in the mid-chassis area has the following configuration rules:

• All processors are supported. Higher TDP processors will require the performance heatsinks.
• Full-length adapter cards are not supported
• GPUs (including low profile GPUs such as the NVIDIA A2) are not supported
• The use of mid drive bays requires Riser 1 be installed, since power for the mid bay backplanes comes from Riser 1

The use of rear drive bays has the following configuration rules:

• The use of rear bays restricts the number of slots and the choice of risers that are supported. See the I/O expansion section for details.
• The use of rear drive bays may require that Riser 1 or Riser 2 be installed, since power for the rear backplane comes from that riser.

The following tables summarize the storage configurations for the SR665 V3. For details, including processor requirements, M.2 and 7mm support, and controller selections, see each of the Details tables.

Overview - 3.5-inch front drives

The following table summarizes the configurations that use 3.5-inch front drive bays.

Click to jump down to the details of the 3.5-inch front drive configurations.

Return to Storage configurations.

Overview - 2.5-inch front drives supporting rear slots (no front slots)

The following table summarizes the configurations that use 2.5-inch front drives supporting rear slots (no front slots).

Click to jump down to the details of the 2.5-inch front drive configurations.

Return to Storage configurations.

Overview - 2.5-inch front drives supporting front slots (no rear slots)

The following table summarizes the configurations that use 2.5-inch front drives supporting front slots (no rear slots).

Click to jump down to the details of the 2.5-inch front drive configurations.

Return to Storage configurations.

Overview - 2.5-inch front drives supporting 12 slots (front & rear)

The following table summarizes the configurations that use 2.5-inch front drives supporting 12 slots (front & rear).

Click to jump down to the details of the 2.5-inch front drive configurations.

Return to Storage configurations.

Details - 3.5-inch front bays

The following table details the configurations that use 3.5-inch front drive bays.

Click to go to the overview of the 3.5-inch front drive configurations.

Return to Storage configurations.

In the table below, the M.2 and 7mm columns have the following meanings:

• M.2 Non-RAID (SATA) means the M.2 SATA/x4 NVMe adapter (4Y37A79663) with SATA drives. No RAID support.
• M.2 Non-RAID (NVMe) means the M.2 SATA/x4 NVMe adapter (4Y37A79663) with NVMe drives. No RAID support.
• M.2 + RAID adapter means the M.2 SATA/x4 NVMe adapter (4Y37A79663) with either a RAID 5350-8i adapter (supporting SATA drives) or a RAID 540-8i (supporting NVMe drives). Adapter installs in a rear PCIe slot.
• M.2 RAID means an M.2 adapter with integrated RAID, either 4Y37A09750 (Marvell) or 4Y37A90063 (Broadcom). RAID-0 and RAID-1 are supported with the integrated RAID controller.
• 7mm Non-RAID (SATA) means the 7mm SATA/NVMe kit (BU0N) with SATA drives. No RAID support.
• 7mm Non-RAID (NVMe) means the 7mm SATA/NVMe kit (BU0N) with NVMe drives. No RAID support.
• 7mm + RAID adapter means the 7mm SATA/NVMe kit (BU0N) with either a RAID 5350-8i adapter (supporting SATA drives) or a RAID 540-8i (supporting NVMe drives). Adapter installs in a rear PCIe slot.
• 7mm RAID means the 7mm kit with integrated RAID, either B8P3 (Marvell) or BYFG (Broadcom). RAID-0 and RAID-1 are supported with the integrated RAID controller.

Details - 2.5-inch front bays supporting rear slots (no front slots)

The following table details the configurations that use 2.5-inch front bays supporting rear slots (no front slots).

Click to go to the overview of the 2.5-inch front drive configurations.

Return to Storage configurations.

In the table below, the M.2 and 7mm columns have the following meanings:

• M.2 Non-RAID (SATA) means the M.2 SATA/x4 NVMe adapter (4Y37A79663) with SATA drives. No RAID support.
• M.2 Non-RAID (NVMe) means the M.2 SATA/x4 NVMe adapter (4Y37A79663) with NVMe drives. No RAID support.
• M.2 + RAID adapter means the M.2 SATA/x4 NVMe adapter (4Y37A79663) with either a RAID 5350-8i adapter (supporting SATA drives) or a RAID 540-8i (supporting NVMe drives). Adapter installs in a rear PCIe slot.
• M.2 RAID means an M.2 adapter with integrated RAID, either 4Y37A09750 (Marvell) or 4Y37A90063 (Broadcom). RAID-0 and RAID-1 are supported with the integrated RAID controller.
• 7mm Non-RAID (SATA) means the 7mm SATA/NVMe kit (BU0N) with SATA drives. No RAID support.
• 7mm Non-RAID (NVMe) means the 7mm SATA/NVMe kit (BU0N) with NVMe drives. No RAID support.
• 7mm + RAID adapter means the 7mm SATA/NVMe kit (BU0N) with either a RAID 5350-8i adapter (supporting SATA drives) or a RAID 540-8i (supporting NVMe drives). Adapter installs in a rear PCIe slot.
• 7mm RAID means the 7mm kit with integrated RAID, either B8P3 (Marvell) or BYFG (Broadcom). RAID-0 and RAID-1 are supported with the integrated RAID controller.